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LC4512B-35F256I

Description
EE PLD, 4.5ns, 512-Cell, CMOS, PBGA256,
CategoryProgrammable logic devices    Programmable logic   
File Size1MB,59 Pages
ManufacturerLattice
Websitehttp://www.latticesemi.com
Download Datasheet Parametric Compare View All

LC4512B-35F256I Overview

EE PLD, 4.5ns, 512-Cell, CMOS, PBGA256,

LC4512B-35F256I Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerLattice
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresYES
In-system programmableYES
JESD-30 codeS-PBGA-B256
JESD-609 codee0
JTAG BSTYES
Humidity sensitivity level3
Number of macro cells512
Number of terminals256
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA256,16X16,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply1.8/3.3,2.5 V
Programmable logic typeEE PLD
propagation delay4.5 ns
Certification statusNot Qualified
surface mountYES
technologyCMOS
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
ispMACH 4000V/B/C Family
TM
3.3V/2.5V/1.8V In-System Programmable
SuperFAST
TM
High Density PLDs
July 2002
Data Sheet
Features
High Performance
• f
MAX
= 400MHz maximum operating frequency
• t
PD
= 2.5ns propagation delay
• Up to four global clock pins with programmable
clock polarity control
• Up to 80 PTs per output
• Enhanced macrocells with individual clock,
reset, preset and clock enable controls
• Up to four global OE controls
• Individual local OE control per I/O pin
• Excellent First-Time-Fit
TM
and refit
• Fast path, SpeedLocking
TM
Path, and wide-PT
path
• Wide input gating (36 input logic blocks) for fast
counters, state machines and address decoders
• 1.8V core E
2
CMOS
®
technology
• CMOS design techniques provide low static and
dynamic power
Broad Device Offering
32 to 512 macrocells
30 to 208 I/O pins
44 to 256 pins/balls in TQFP or fpBGA packages
Commercial and industrial temperature ranges
Easy System Integration
Ease of Design
• Operation with 3.3V, 2.5V or 1.8V LVCMOS I/O
• Operation with 3.3V (4000V), 2.5V (4000B) or
1.8V (4000C) supplies
• Hot-socketing
• Open-drain capability
• Input pull-up, pull-down or bus-keeper
• Programmable output slew rate
• 3.3V PCI compatible
• IEEE 1149.1 boundary scan testable
• 3.3V/2.5V/1.8V In-System Programmable
(ISP™) using IEEE 1532 compliant interface
• I/O pins with fast setup path
Low Power
Table 1. ispMACH 4000V/B/C Family Selection Guide
ispMACH
4032V/B/C
Macrocells
User I/O Options
t
PD
(ns)
t
S
(ns)
t
CO
(ns)
f
MAX
(MHz)
Supply Voltages (V)
Pins/Package
32
30/32
2.5
1.8
2.2
400
3.3/2.5/1.8V
44 TQFP
48 TQFP
ispMACH
4064V/B/C
64
30/32/64
2.5
1.8
2.2
400
3.3/2.5/1.8V
44 TQFP
48 TQFP
100 TQFP
ispMACH
4128V/B/C
128
64/92
2.7
1.8
2.7
333
3.3/2.5/1.8V
ispMACH
4256V/B/C
256
64/128/160
3.0
2.0
2.7
322
3.3/2.5/1.8V
ispMACH
4384V/B/C
384
128/192
3.5
2.0
2.7
322
3.3/2.5/1.8V
ispMACH
4512V/B/C
512
128/208
3.5
2.0
2.7
322
3.3/2.5/1.8V
100 TQFP
128 TQFP
100 TQFP
176 TQFP
256 fpBGA*
176 TQFP
256 fpBGA
176 TQFP
256 fpBGA
*128-I/O and 160-I/O configurations.
www.latticesemi.com
1
ispm4k_10

LC4512B-35F256I Related Products

LC4512B-35F256I LC4512C-35T176I LC4512C-35F256I LC4256B-3T100I LC4512B-35T176I
Description EE PLD, 4.5ns, 512-Cell, CMOS, PBGA256, EE PLD, 4.5ns, 512-Cell, CMOS, PQFP176, EE PLD, 4.5ns, 512-Cell, CMOS, PBGA256, EE PLD, 3.8ns, 256-Cell, CMOS, PQFP100, EE PLD, 4.5ns, 512-Cell, CMOS, PQFP176,
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code compliant _compli compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Other features YES YES YES YES YES
In-system programmable YES YES YES YES YES
JESD-30 code S-PBGA-B256 S-PQFP-G176 S-PBGA-B256 S-PQFP-G100 S-PQFP-G176
JESD-609 code e0 e0 e0 e0 e0
JTAG BST YES YES YES YES YES
Humidity sensitivity level 3 3 3 3 3
Number of macro cells 512 512 512 256 512
Number of terminals 256 176 256 100 176
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA QFP BGA QFP QFP
Encapsulate equivalent code BGA256,16X16,40 QFP176,1.0SQ,20 BGA256,16X16,40 QFP100,.63SQ,20 QFP176,1.0SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY FLATPACK GRID ARRAY FLATPACK FLATPACK
Peak Reflow Temperature (Celsius) 225 256 225 240 256
power supply 1.8/3.3,2.5 V 1.8,1.8/3.3 V 1.8,1.8/3.3 V 1.8/3.3,2.5 V 1.8/3.3,2.5 V
Programmable logic type EE PLD EE PLD EE PLD EE PLD EE PLD
propagation delay 4.5 ns 4.5 ns 4.5 ns 3.8 ns 4.5 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn85Pb15) Tin/Lead (Sn63Pb37) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15)
Terminal form BALL GULL WING BALL GULL WING GULL WING
Terminal pitch 1 mm 0.5 mm 1 mm 0.5 mm 0.5 mm
Terminal location BOTTOM QUAD BOTTOM QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
package instruction - QFP, QFP176,1.0SQ,20 - QFP, QFP100,.63SQ,20 QFP, QFP176,1.0SQ,20
Base Number Matches - 1 1 1 -
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