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K3N3C3000D-GC100

Description
MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32
Categorystorage    storage   
File Size45KB,3 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K3N3C3000D-GC100 Overview

MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32

K3N3C3000D-GC100 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeSOIC
package instructionSOP,
Contacts32
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time100 ns
JESD-30 codeR-PDSO-G32
length20.47 mm
memory density4194304 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height3 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width11.43 mm
K3N3C3000D-D(G)C
4M-Bit (512Kx8) CMOS MASK ROM
FEATURES
524,288x8 bit organization
Access time : 80ns(Max.)
Supply voltage : single +5V
Current consumption
Operating : 50mA(Max.)
Standby : 50µA(Max.)
Fully static operation
All inputs and outputs TTL compatible
Three state outputs
Package
-. K3N3C3000D-DC : 32-DIP-600
-. K3N3C3000D-GC : 32-SOP-525
CMOS MASK ROM
GENERAL DESCRIPTION
The K3N3C3000D-D(G)C is a fully static mask programmable
ROM organized 524,288 x 8 bit. It is fabricated using silicon
gate CMOS process technology.
This device operates with a 5V single power supply, and all
inputs and outputs are TTL compatible.
Because of its asynchronous operation, it requires no external
clock assuring extremely easy operation.
It is suitable for use in program memory of microprocessor, and
data memory, character generator.
The K3N3C3000D-DC is packaged in a 32-DIP and the
K3N3C3000D-GC in a 32-SOP.
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATION
A
18
.
.
.
.
.
.
.
.
A
0
X
BUFFERS
AND
DECODER
MEMORY CELL
MATRIX
(524,288x8)
N.C
A
16
A
15
A
12
1
2
3
4
5
6
7
8
9
32 V
CC
31 A
18
30 A
17
29 A
14
28 A
13
27 A
8
Y
BUFFERS
AND
DECODER
SENSE AMP.
BUFFERS
A
7
A
6
A
5
A
4
A
3
DIP
&
SOP
26 A
9
25 A
11
24 OE
23 A
10
21 CE
21 Q
7
20 Q
6
19 Q
5
18 Q
4
17 Q
3
. . .
A
1
A
2
10
11
12
13
14
15
CE
OE
CONTROL
LOGIC
Q
0
Q
7
A
0
Q
0
Q
1
Q
2
Pin Name
A
0
- A
18
Q
0
- Q
7
CE
OE
V
CC
V
SS
N.C
Pin Function
Address Inputs
Data Outputs
Chip Enable
Output Enable
Power(+5V)
Ground
No Connection
V
SS
16
K3N3C3000D-D(G)C

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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