LD112 datasheet, PDF - EEWORLD Datasheet

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LD112: DescriptionOperational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, 0.062 X 0.072 INCH, DIE-8; CategoryAnalog mixed-signal IC Amplifier circuit; File Size143KB，4 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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LD112 Overview

Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, 0.062 X 0.072 INCH, DIE-8

LD112 Parametric

Parameter Name	Attribute value
Maker	AMD
Parts packaging code	DIE
package instruction	DIE, DIE OR CHIP
Contacts	8
Reach Compliance Code	unknown
ECCN code	EAR99
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.003 µA
Nominal Common Mode Rejection Ratio	85 dB
frequency compensation	YES
Maximum input offset voltage	3000 µV
JESD-30 code	R-XUUC-N8
low-dissonance	NO
Nominal Negative Supply Voltage (Vsup)	-15 V
Number of functions	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Encapsulate equivalent code	DIE OR CHIP
Package shape	RECTANGULAR
Package form	UNCASED CHIP
power supply	+-5/+-20 V
Certification status	Not Qualified
Maximum slew rate	0.6 mA
Nominal supply voltage (Vsup)	15 V
surface mount	YES
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal location	UPPER

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LD112 Related Products

	LD112	LM212D	LM112F	LM112D	LM312D	LD312
Description	Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, 0.062 X 0.072 INCH, DIE-8	Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14	Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, CDFP10, HERMETIC SEALED, CERPACK-10	Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14	Operational Amplifier, 1 Func, 10000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14	Operational Amplifier, 1 Func, 10000uV Offset-Max, BIPolar, 0.062 X 0.072 INCH, DIE-8
Parts packaging code	DIE	DIP	DFP	DIP	DIP	DIE
package instruction	DIE, DIE OR CHIP	HERMETIC SEALED, DIP-14	DFP, FL10,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIE, DIE OR CHIP
Contacts	8	14	10	14	14	8
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.003 µA	0.003 µA	0.003 µA	0.003 µA	0.01 µA	0.01 µA
Nominal Common Mode Rejection Ratio	85 dB	85 dB	85 dB	85 dB	80 dB	80 dB
frequency compensation	YES	YES	YES	YES	YES	YES
Maximum input offset voltage	3000 µV	3000 µV	3000 µV	3000 µV	10000 µV	10000 µV
JESD-30 code	R-XUUC-N8	R-CDIP-T14	R-CDFP-F10	R-CDIP-T14	R-CDIP-T14	R-XUUC-N8
low-dissonance	NO	NO	NO	NO	NO	NO
Nominal Negative Supply Voltage (Vsup)	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V
Number of functions	1	1	1	1	1	1
Number of terminals	8	14	10	14	14	8
Maximum operating temperature	125 °C	85 °C	125 °C	125 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-25 °C	-55 °C	-55 °C	-	-
Package body material	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
encapsulated code	DIE	DIP	DFP	DIP	DIP	DIE
Encapsulate equivalent code	DIE OR CHIP	DIP14,.3	FL10,.3	DIP14,.3	DIP14,.3	DIE OR CHIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	IN-LINE	FLATPACK	IN-LINE	IN-LINE	UNCASED CHIP
power supply	+-5/+-20 V	+-5/+-20 V	+-5/+-20 V	+-5/+-20 V	+-5/+-15 V	+-5/+-15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.6 mA	0.6 mA	0.6 mA	0.6 mA	0.8 mA	0.8 mA
Nominal supply voltage (Vsup)	15 V	15 V	15 V	15 V	15 V	15 V
surface mount	YES	NO	YES	NO	NO	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	OTHER	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal location	UPPER	DUAL	DUAL	DUAL	DUAL	UPPER
Maker	AMD	-	AMD	AMD	AMD	AMD
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	-
Maximum bias current (IIB) at 25C	-	0.002 µA	0.002 µA	0.002 µA	0.007 µA	-
JESD-609 code	-	e0	e0	e0	e0	-
length	-	19.431 mm	6.1595 mm	19.431 mm	19.431 mm	-
Maximum seat height	-	5.08 mm	2.032 mm	5.08 mm	5.08 mm	-
Supply voltage upper limit	-	20 V	20 V	20 V	20 V	-
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal pitch	-	2.54 mm	1.27 mm	2.54 mm	2.54 mm	-
Minimum voltage gain	-	25000	25000	25000	15000	-
width	-	7.62 mm	6.35 mm	7.62 mm	7.62 mm	-

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