IC,SHIFT REGISTER,LS-TTL,DIP,20PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | DIP, DIP20,.3 |
Reach Compliance Code | unknown |
Counting direction | BIDIRECTIONAL |
JESD-30 code | R-XDIP-T20 |
JESD-609 code | e0 |
Number of digits | 8 |
Number of functions | 1 |
Number of terminals | 20 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
DM54LS323J/883 | DM54LS323W/883 | |
---|---|---|
Description | IC,SHIFT REGISTER,LS-TTL,DIP,20PIN,CERAMIC | IC,SHIFT REGISTER,LS-TTL,LLCC,20PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible |
Maker | Texas Instruments | Texas Instruments |
package instruction | DIP, DIP20,.3 | QCCN, LCC20,.35SQ |
Reach Compliance Code | unknown | unknown |
Counting direction | BIDIRECTIONAL | BIDIRECTIONAL |
JESD-30 code | R-XDIP-T20 | S-XQCC-N20 |
JESD-609 code | e0 | e0 |
Number of digits | 8 | 8 |
Number of functions | 1 | 1 |
Number of terminals | 20 | 20 |
Maximum operating temperature | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C |
Package body material | CERAMIC | CERAMIC |
encapsulated code | DIP | QCCN |
Encapsulate equivalent code | DIP20,.3 | LCC20,.35SQ |
Package shape | RECTANGULAR | SQUARE |
Package form | IN-LINE | CHIP CARRIER |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | NO | YES |
technology | TTL | TTL |
Temperature level | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | NO LEAD |
Terminal pitch | 2.54 mm | 1.27 mm |
Terminal location | DUAL | QUAD |