Bus Driver, M66000 Series, 1-Func, 10-Bit, Inverted Output, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOP-24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Mitsubishi |
Parts packaging code | SOIC |
package instruction | SOP, SOP24,.4 |
Contacts | 24 |
Reach Compliance Code | unknown |
series | M66000 |
JESD-30 code | R-PDSO-G24 |
JESD-609 code | e0 |
length | 15.02 mm |
Load capacitance (CL) | 200 pF |
Logic integrated circuit type | BUS DRIVER |
MaximumI(ol) | 0.024 A |
Number of digits | 10 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 24 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output characteristics | 3-STATE |
Output polarity | INVERTED |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP24,.4 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Prop。Delay @ Nom-Sup | 21 ns |
propagation delay (tpd) | 31 ns |
Certification status | Not Qualified |
Maximum seat height | 2.1 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 5.3 mm |
M66211FP | M66211P | M66210P | M66210FP | |
---|---|---|---|---|
Description | Bus Driver, M66000 Series, 1-Func, 10-Bit, Inverted Output, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOP-24 | Bus Driver, M66000 Series, 1-Func, 10-Bit, Inverted Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Bus Driver, M66000 Series, 1-Func, 10-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Bus Driver, M66000 Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOP-24 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | Mitsubishi | Mitsubishi | Mitsubishi | Mitsubishi |
Parts packaging code | SOIC | DIP | DIP | SOIC |
package instruction | SOP, SOP24,.4 | 0.300 INCH, PLASTIC, DIP-24 | 0.300 INCH, PLASTIC, DIP-24 | SOP, SOP24,.3 |
Contacts | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
series | M66000 | M66000 | M66000 | M66000 |
JESD-30 code | R-PDSO-G24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 |
JESD-609 code | e0 | e0 | e0 | e0 |
length | 15.02 mm | 29.2 mm | 29.2 mm | 15.02 mm |
Load capacitance (CL) | 200 pF | 200 pF | 200 pF | 200 pF |
Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
Number of digits | 10 | 10 | 10 | 10 |
Number of functions | 1 | 1 | 1 | 1 |
Number of ports | 2 | 2 | 2 | 2 |
Number of terminals | 24 | 24 | 24 | 24 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Output polarity | INVERTED | INVERTED | TRUE | TRUE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | DIP | DIP | SOP |
Encapsulate equivalent code | SOP24,.4 | DIP24,.3 | DIP24,.3 | SOP24,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Sup | 21 ns | 21 ns | 21 ns | 21 ns |
propagation delay (tpd) | 31 ns | 31 ns | 31 ns | 31 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 2.1 mm | 4.5 mm | 4.5 mm | 2.1 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 5.3 mm | 7.62 mm | 7.62 mm | 5.3 mm |