MASK ROM, 32MX16, 100ns, CMOS, PDSO70, 0.500 INCH, 0.80 MM PITCH, PLASTIC, SSOP-70
Parameter Name | Attribute value |
Maker | LAPIS Semiconductor Co., Ltd. |
Parts packaging code | SSOP |
package instruction | SSOP, |
Contacts | 70 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 100 ns |
Spare memory width | 8 |
JESD-30 code | R-PDSO-G70 |
length | 28.6 mm |
memory density | 536870912 bit |
Memory IC Type | MASK ROM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 70 |
word count | 33554432 words |
character code | 32000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SSOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, SHRINK PITCH |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 3.05 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | DUAL |
width | 12.7 mm |
MR26V51203L-XXXMB | MR26V51203L-XXXMBE | |
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Description | MASK ROM, 32MX16, 100ns, CMOS, PDSO70, 0.500 INCH, 0.80 MM PITCH, PLASTIC, SSOP-70 | MASK ROM, 32MX16, 120ns, CMOS, PDSO70, 0.500 INCH, 0.80 MM PITCH, PLASTIC, SSOP-70 |
Maker | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. |
Parts packaging code | SSOP | SSOP |
package instruction | SSOP, | SSOP, |
Contacts | 70 | 70 |
Reach Compliance Code | unknown | unknown |
ECCN code | EAR99 | EAR99 |
Maximum access time | 100 ns | 120 ns |
Spare memory width | 8 | 8 |
JESD-30 code | R-PDSO-G70 | R-PDSO-G70 |
length | 28.6 mm | 28.6 mm |
memory density | 536870912 bit | 536870912 bit |
Memory IC Type | MASK ROM | MASK ROM |
memory width | 16 | 16 |
Number of functions | 1 | 1 |
Number of terminals | 70 | 70 |
word count | 33554432 words | 33554432 words |
character code | 32000000 | 32000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C |
organize | 32MX16 | 32MX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SSOP | SSOP |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
Parallel/Serial | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 3.05 mm | 3.05 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V |
surface mount | YES | YES |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal form | GULL WING | GULL WING |
Terminal pitch | 0.8 mm | 0.8 mm |
Terminal location | DUAL | DUAL |
width | 12.7 mm | 12.7 mm |