4MX32 FAST PAGE DRAM MODULE, 70ns, DMA72, DIMM-72
Parameter Name | Attribute value |
Maker | Renesas Electronics Corporation |
Parts packaging code | DIMM |
Contacts | 72 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 70 ns |
I/O type | COMMON |
JESD-30 code | R-PDMA-N72 |
memory density | 134217728 bit |
Memory IC Type | FAST PAGE DRAM MODULE |
memory width | 32 |
Number of terminals | 72 |
word count | 4194304 words |
character code | 4000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX32 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIMM |
Encapsulate equivalent code | DIMM72 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 2048 |
Maximum seat height | 25.4 mm |
self refresh | YES |
Maximum standby current | 0.0012 A |
Maximum slew rate | 0.72 mA |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
MC-42S4000LAC32SA-70 | MC-42S4000LAC32SA-60 | |
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Description | 4MX32 FAST PAGE DRAM MODULE, 70ns, DMA72, DIMM-72 | MEMORY MODULE,DRAM,FAST PAGE,4MX32,CMOS,DIMM,72PIN,PLASTIC |
Maker | Renesas Electronics Corporation | Renesas Electronics Corporation |
Parts packaging code | DIMM | DIMM |
Contacts | 72 | 72 |
Reach Compliance Code | compliant | compli |
ECCN code | EAR99 | EAR99 |
Maximum access time | 70 ns | 60 ns |
I/O type | COMMON | COMMON |
JESD-30 code | R-PDMA-N72 | R-PDMA-N72 |
memory density | 134217728 bit | 134217728 bi |
Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
memory width | 32 | 32 |
Number of terminals | 72 | 72 |
word count | 4194304 words | 4194304 words |
character code | 4000000 | 4000000 |
Maximum operating temperature | 70 °C | 70 °C |
organize | 4MX32 | 4MX32 |
Output characteristics | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIMM | DIMM |
Encapsulate equivalent code | DIMM72 | DIMM72 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
power supply | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified |
refresh cycle | 2048 | 2048 |
Maximum seat height | 25.4 mm | 25.4 mm |
self refresh | YES | YES |
Maximum standby current | 0.0012 A | 0.0012 A |
Maximum slew rate | 0.72 mA | 0.8 mA |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD |
Terminal pitch | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL |