RCDL56DPI Related Products
|
RCDL56DPI |
RCVDL56DPI |
RCVDL56DPI/SP |
Description |
Modem, PQCC68, |
Modem, PQCC68, |
Modem, PQCC68, |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
package instruction |
QCCJ, LDCC68(UNSPEC) |
QCCJ, LDCC68(UNSPEC) |
QCCJ, LDCC68(UNSPEC) |
Reach Compliance Code |
compliant |
compliant |
compliant |
JESD-609 code |
e0 |
e0 |
e0 |
Number of terminals |
68 |
68 |
68 |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
QCCJ |
QCCJ |
QCCJ |
Encapsulate equivalent code |
LDCC68(UNSPEC) |
LDCC68(UNSPEC) |
LDCC68(UNSPEC) |
Package form |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
power supply |
5 V |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum slew rate |
202 mA |
202 mA |
202 mA |
Nominal supply voltage |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
YES |
Telecom integrated circuit types |
MODEM |
MODEM |
MODEM |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
J BEND |
J BEND |
J BEND |
Terminal location |
QUAD |
QUAD |
QUAD |