FIFO, 1KX9, 55ns, Asynchronous, CMOS, CDIP28,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | TEMIC |
Reach Compliance Code | unknown |
Maximum access time | 55 ns |
Maximum clock frequency (fCLK) | 14.29 MHz |
JESD-30 code | R-XDIP-T28 |
JESD-609 code | e0 |
memory density | 9216 bit |
Memory IC Type | OTHER FIFO |
memory width | 9 |
Number of terminals | 28 |
word count | 1024 words |
character code | 1000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 1KX9 |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum standby current | 0.000008 A |
Maximum slew rate | 0.07 mA |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |