NANDxxxxMx
256/512-Mbit or 1-Gbit (x8/x16, 1.8/2.6 V, 528-byte page) NAND
flash and 256/512-Mbit (x16/x32, 1.8 V) LPSDRAM, MCP or PoP
Features
n
FBGA
Packages
– MCP (multichip package)
– PoP (package on package)
Device composition
– 1 die of 256 or 512 Mbits or 1 Gbit (x8/x16)
SLC small page NAND flash memory
– 1 die of 256 or 512 Mbits (x16 or x32)
SDR/DDR LPSDRAM
Supply voltages
– V
DDF
= 1.7 V to 1.95 V or 2.5 V to 3.6 V
– V
DDD
= V
DDQD
= 1.7 V to 1.95 V
Electronic signature
ECOPACK
®
packages
Temperature range: –30 to 85 °C
n
n
TFBGA107 10.5 × 13 × 1.2 mm (ZBB)
TFBGA149 10 × 13.5 × 1.2 mm (ZBA)
TFBGA137 10.5 × 13 × 1.2 mm (ZBC)
LFBGA137 10.5 × 13 × 1.4 mm (ZBC)
FBGA
n
TFBGA152 14 x 14 x 1.1 mm (ZPA)
Data integrity
– 100 000 program/erase cycles
– 10 years data retention
n
n
n
Flash memory
n
Single or double data rate LPSDRAM
n
n
n
n
n
n
NAND interface
– x8/x16 bus width
– Multiplexed address/data
Page size
– x8 device: (512 + 16 spare) bytes
– x16 device: (256 + 8 spare) words
Block size
– x8 device: (16K + 512 spare) bytes
– x16 device: (8K + 256 spare) words
Page read/program
– Random access: 12 µs (3 V), 15 µs (1.8 V)
– Sequential access: 30 ns (3 V), 50 ns
(1.8 V)
– Page program time: 200 µs (typ)
Copy back program mode
– Fast page copy without external buffering
Fast block erase
– Block erase time: 2 ms (typ)
– Status register
Interface: ×16 or ×32 bus width
Deep power-down mode
1.8 V LVCMOS interface
Quad internal banks controlled by BA0, BA1
Automatic and controlled precharge
Auto refresh and self refresh
– 8 192 refresh cycles/64 ms
– Programmable partial array self refresh
– Auto temperature compensated self refresh
Wrap sequence: sequential/interleave
Burst termination by Burst Stop command and
Precharge command
Device summary
NAND99W3M0 NAND98R4M2
NAND99W3M1 NAND99R3M1
NANDA9W3M1
NAND99R4M2
NAND98W3M1
NAND98R3M2
n
n
n
n
n
Table 1.
NANDxxxxMx
Rev 13
n
n
NAND88R3M0
NAND98R3M0
NAND98W3M0
NAND99R3M0
NAND99R3M2
NAND98R3M1
October 2008
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www.numonyx.com
1
Contents
NANDxxxxMx
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1
1.2
NAND flash memory component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
LPSDRAM component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Signals description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
2.14
2.15
2.16
2.17
2.18
2.19
2.20
2.21
2.22
2.23
2.24
2.25
2.26
Flash memory inputs/outputs (I/O0-I/O7) . . . . . . . . . . . . . . . . . . . . . . . . . 16
Flash memory inputs/outputs (I/O8-I/O15) . . . . . . . . . . . . . . . . . . . . . . . . 16
Flash memory Address Latch Enable (AL) . . . . . . . . . . . . . . . . . . . . . . . . 16
Flash memory Command Latch Enable (CL) . . . . . . . . . . . . . . . . . . . . . . 16
Flash memory Chip Enable (E
F
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Flash memory Read Enable (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Flash memory Write Enable (W
F
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Flash memory Write Protect (WP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Flash memory Ready/Busy (RB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Flash memory V
DDF
supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Flash memory V
SSF
ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
LPSDRAM address inputs (A0-A12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
LPSDRAM bank select address inputs (BA0-BA1) . . . . . . . . . . . . . . . . . 18
LPSDRAM data inputs/outputs (DQ0-DQ15 and DQ16-DQ31) . . . . . . . . 18
LPSDRAM Chip Select (E
D
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
LPSDRAM Column Address Strobe (CAS) . . . . . . . . . . . . . . . . . . . . . . . 18
LPSDRAM Row Address Strobe (RAS) . . . . . . . . . . . . . . . . . . . . . . . . . . 18
LPSDRAM Write Enable (W
D
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
LPSDRAM Clock Input (K) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
LPSDRAM Clock Input (K) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
LPSDRAM Clock Enable (KE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Lower/Upper Data Read/Write Strobe input/output (LDQS, UDQS) . . . . 19
LPSDRAM data input/output mask pins (DQM0, DQM1, DQM2, DQM3) 19
LPSDRAM V
DDD
supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
LPSDRAM V
DDQD
supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
LPSDRAM V
SSD
ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2/32
NANDxxxxMx
Contents
2.27
V
SSQD
ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3
4
5
6
7
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3/32
List of tables
NANDxxxxMx
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
LPSDRAM details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Signal names (TFBGA107, TFBGA137 and TFBGA149 packages) . . . . . . . . . . . . . . . . . 10
Signal names (TFBGA152 package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
TFBGA107 10.5 × 13 x 1.2 mm - 10 × 14 active ball array, 0.80 mm pitch,
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
TFBGA137 10.5 x 13 x 1.2 mm - 10 x 15 active ball array, 0.80 mm pitch,
mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
TFBGA149 10 × 13.5 x 1.2 mm - 12 × 16 active ball array, 0.80 mm pitch,
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
TFBGA152 14 × 14 x 1.1 mm - 2R 21 x 21, 0.65 mm pitch, mechanical data . . . . . . . . . . 29
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4/32
NANDxxxxMx
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Logic diagram (TFBGA107, TFBGA137and TFBGA149 packages). . . . . . . . . . . . . . . . . . . 8
Logic diagram (TFBGA152 package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
TFBGA107 connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
TFBGA137 connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
TFBGA149 connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
TFBGA152 connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Functional block diagram (TFBGA107, TFBGA137, TFBGA149). . . . . . . . . . . . . . . . . . . . 22
Functional block diagram (TFBGA152) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
TFBGA107 10.5 × 13 x 1.2 mm - 10 × 14 active ball array, 0.80 mm pitch,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
TFBGA137 10.5 x 13 x 1.2 mm - 10 x 13 active ball array, 0.80 mm pitch,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
TFBGA149 10 × 13.5 x 1.2 mm - 12 × 16 active ball array, 0.80 mm pitch,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
TFBGA152 14 × 14 x 1.1 mm - 2R 21 x 21 , 0.65 mm pitch, package outline . . . . . . . . . . 29
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RF/Wirelessly
京公网安备 11010802033920号
EEWORLD
