P3PS550AH
High Drive General Purpose
Peak EMI Reduction IC
Product Description
The P3PS550AH is a versatile 2.3 V to 3.6 V, Timing−Safe™, high
drive spread spectrum frequency modulator designed specifically for a
wide range of clock frequencies. The P3PS550AH reduces
electromagnetic interference (EMI) at the clock source, allowing
system wide reduction of EMI of all clock dependent signals. The
P3PS550AH allows significant system cost savings by reducing the
number of circuit board layers ferrite beads, shielding that are
traditionally required to pass EMI regulations.
Features
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MARKING
DIAGRAMS
1
WDFN8
CASE 511AQ
1
CCMG
G
•
•
•
•
•
•
•
•
High Drive, LVCMOS Peak EMI reduction IC
Input Clock Frequency: 18 MHz
−
36 MHz
Output Clock Frequency: 18 MHz
−
36 MHz
Eight different selectable Spread options
Power Down option for power save
Supply Voltage: 2.3 V
−
3.6 V
8−pin WDFN, 2 mm x 2 mm (TDFN) Package
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
CC = Specific Device Code
M = Date Code
G
= Pb−Free Device
PIN CONFIGURATION
CLKIN
SR2
PD#
VSS
1
2
P3PS550AH
3
4
8
7
6
5
VDD
SR0
SR1
ModOUT
Applications
•
The P3PS550AH is targeted towards consumer electronic
applications.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
©
Semiconductor Components Industries, LLC, 2010
July, 2010
−
Rev. 1
1
Publication Order Number:
P3PS550AH/D
P3PS550AH
VDD
SR0
SR1
SR2
CLKIN
PLL
ModOUT
VSS
PD#
Figure 1. Block Diagram
P3PS550AH modulates the output of a single PLL in
order to “spread” the bandwidth of a synthesized clock, and
more importantly, decreases the peak amplitudes of its
harmonics. This results in significantly lower system EMI
compared to the typical narrow band signal produced by
oscillators and most frequency generators. Lowering EMI
by increasing a signal’s bandwidth is called ‘spread
spectrum clock generation’.
Table 1. PIN DESCRIPTION
Pin#
1
2
3
Pin Name
CLKIN
SR2
PD#
Type
I
I
I
External reference clock input.
P3PS550AH accepts an input from an external reference
clock and locks to a 1x modulated clock output. SR0, SR1
and SR2 pins enable selecting one of the eight different
frequency deviations (Refer
Frequency Deviation Selection
table).
P3PS550AH also features power down option for
power save. P3PS550AH operates over a supply voltage
range of 2.3 V to 3.6 V. P3PS550AH is available in an 8 Pin
WDFN, (2 mm x 2 mm) Package.
Description
Digital logic input used to select Spreading Range. There is NO default state.
Refer
Frequency Deviation Selection Table.
Power−down control pin. Powers down the entire chip. There is NO default state. Pull low to en-
able power−down mode. Connect to VDD to disable Power Down.
Output Clock will be LOW when power down is enabled
Ground connection.
Spread Spectrum Clock Output.
Digital logic input used to select Spreading Range. This pin has an internal pull−up resistor. Refer
Modulation Selection Table.
Digital logic input used to select Spreading Range. There is NO default state.
Refer
Frequency Deviation Selection Table.
Power supply for the entire chip
4
5
6
7
8
VSS
ModOUT
SR1
SR0
VDD
P
O
I
I
P
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2
P3PS550AH
Table 2. FREQUENCY DEVIATION SELECTION TABLE
Spreading Range ($ %)
SR2
0
0
0
0
1
1
1
1
SR1
0
0
1
1
0
0
1
1
SR0
0
1
0
1
0
1
0
1
(@ 24 MHz)
1
2.5
1.25
1.5
0.4
0.75
1.75
2
Table 3. OPERATING CONDITIONS
Symbol
V
DD
T
A
C
L
C
IN
Supply Voltage with respect to VSS
Operating temperature
Load Capacitance
Input Capacitance
Parameter
Min
2.3
−20
Max
3.6
+85
15
7
Unit
V
°C
pF
pF
Table 4. ABSOLUTE MAXIMUM RATING
Symbol
V
DD
, V
IN
T
STG
T
s
T
J
T
DV
Parameter
Voltage on any input pin with respect to V
SS
Storage temperature
Max. Soldering Temperature (10 sec)
Junction Temperature
Static Discharge Voltage (As per JEDEC STD22−A114−B)
Rating
−0.5
to +4.6
−65
to +125
260
150
2
Unit
V
°C
°C
°C
kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.
Table 5. DC ELECTRICAL CHARACTERISTICS
Symbol
VDD
V
IH
V
IL
I
IH
I
IL
V
OH
V
OL
I
CC
I
DD
Z
OUT
Parameter
Supply Voltage with respect to V
SS
Input high voltage
Input low voltage
Input high current (SR1 control pin)
Input low current (SR1 control pin)
Output high voltage (I
OH
=
−
16 mA)
Output low voltage (I
OL
= 16 mA)
Static supply current (PD# pulled to V
SS
)
Dynamic supply current (Unloaded Output @ 24 MHz)
Output impedance
6
20
0.75 * V
DD
0.2 * V
DD
1
9
Min
2.3
0.65 * V
DD
0.3 * V
DD
50
50
Typ
2.8
Max
3.6
Unit
V
V
V
mA
mA
V
V
mA
mA
W
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P3PS550AH
Table 6. AC ELECTRICAL CHARACTERISTICS
Symbol
CLKIN
ModOUT
t
LH
(Note 1)
t
HL
(Note 1)
t
JC
(Note 1)
t
D
(Note 1)
t
ON
(Note 1)
Input Clock frequency
Output Clock frequency
Output rise time
(Measured between 20% to 80%)
Output fall time
(Measured between 80% to 20%)
Jitter (cycle to cycle) Unloaded Output
Output duty cycle
PLL lock Time
(Stable power supply, valid clock presented on CLKIN pin,
PD# toggled from Low to High)
Frequency Deviation Variation across PVT
$2.5
45
Unloaded Output
C
L
= 15 pF
Unloaded Output
C
L
= 15 pF
Parameter
Min
18
18
Typ
24
24
0.4
1.4
0.3
1.1
$175
50
Max
36
36
0.8
2.2
0.6
1.9
$250
55
3
ps
%
ms
ns
Unit
MHz
MHz
ns
fd
var
$5
%
1. Parameter is guaranteed by design and characterization. Not 100% tested in production
VDDIN
R
C1
C2
8
1 CLKIN
VDD
0.1mF
2.2mF
M Clock
P3PS550AH
Rs
VDD
SR2, SR1, SR0
Frequency Deviation
Selection Control
0
W
0
W
2,6,7
SR2/SR1/SR0
VSS
4
ModOUT
5
VDD
0
W
PD#
3
0
W
Power Down
Control
ModOUT Clock
NOTE:
Refer Pin Description table for Functionality details.
Figure 2. Typical Application Schematic
PCB Layout Recommendation
For optimum device performance, following guidelines are recommended.
•
Dedicated VDD and GND planes.
•
The device must be isolated from system power supply noise. A 0.1mF and a 2.2
mF
decoupling capacitor should be
mounted on the component side of the board as close to the VDD pin as possible. No vias should be used between the
decoupling capacitor and VDD pin. The PCB trace to VDD pin and the ground via should be kept as short as possible.
All the VDD pins should have decoupling capacitors.
•
In an optimum layout all components are on the same side of the board, minimizing vias through other signal layers.
A typical layout is shown in the figure
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4
P3PS550AH
As short as
possible
R
As short as
possible
CLKIN
SR2
PD#
VSS
VDD
SR0
SR1
GND
Modout
Rs
Figure 3.
ORDERING INFORMATION
Part Number
P3PS550AHG−08CR
Top Marking
CC
Temperature
−20°C
to +85°C
Package Type
8−pin (2 mm x 2 mm)
WDFN
Shipping
†
Tape & Reel
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5
Microcontroller MCU
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