2681/BUA datasheet, PDF - EEWORLD Datasheet

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2681/BUA: DescriptionIC 2 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CQCC44, CERAMIC, LLCC-44, Serial IO/Communication Controller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size918KB，21 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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2681/BUA Overview

IC 2 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CQCC44, CERAMIC, LLCC-44, Serial IO/Communication Controller

2681/BUA Parametric

Parameter Name	Attribute value
Parts packaging code	LCC
package instruction	QCCN,
Contacts	44
Reach Compliance Code	unknow
Address bus width	4
boundary scan	NO
maximum clock frequency	4 MHz
letter of agreement	ASYNC, BIT; SYNC, BYTE
Data encoding/decoding methods	NRZ
Maximum data transfer rate	0.125 MBps
External data bus width	8
JESD-30 code	S-CQCC-N44
length	16.5354 mm
low power mode	NO
Number of DMA channels
Number of I/O lines	15
Number of serial I/Os	2
Number of terminals	44
On-chip data RAM width
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
Certification status	Not Qualified
RAM (number of words)	0
Maximum seat height	3.048 mm
Maximum slew rate	175 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	MOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	16.5354 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches	1

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2681/BUA Related Products

	2681/BUA	2681/BQA	2681/BXA	2681/BYA
Description	IC 2 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CQCC44, CERAMIC, LLCC-44, Serial IO/Communication Controller	IC 2 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP40, CERAMIC, DIP-40, Serial IO/Communication Controller	IC 2 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, CERAMIC, DIP-28, Serial IO/Communication Controller	IC 2 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, DFP52, FP-52, Serial IO/Communication Controller
Parts packaging code	LCC	DIP	DIP	DFP
package instruction	QCCN,	DIP,	DIP,	DFP,
Contacts	44	40	28	52
Reach Compliance Code	unknow	unknow	unknow	unknow
Address bus width	4	4	4	4
boundary scan	NO	NO	NO	NO
maximum clock frequency	4 MHz	4 MHz	4 MHz	4 MHz
letter of agreement	ASYNC, BIT; SYNC, BYTE	ASYNC, BIT; SYNC, BYTE	ASYNC, BIT; SYNC, BYTE	ASYNC, BIT; SYNC, BYTE
Data encoding/decoding methods	NRZ	NRZ	NRZ	NRZ
Maximum data transfer rate	0.125 MBps	0.125 MBps	0.125 MBps	0.125 MBps
External data bus width	8	8	8	8
JESD-30 code	S-CQCC-N44	R-GDIP-T40	R-GDIP-T28	R-XDFP-F52
low power mode	NO	NO	NO	NO
Number of I/O lines	15	15	3	15
Number of serial I/Os	2	2	2	2
Number of terminals	44	40	28	52
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	UNSPECIFIED
encapsulated code	QCCN	DIP	DIP	DFP
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE	FLATPACK
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	175 mA	175 mA	175 mA	175 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES
technology	MOS	MOS	MOS	MOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal location	QUAD	DUAL	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches	1	1	1	1
Maximum seat height	3.048 mm	5.715 mm	5.8928 mm	-
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	-
width	16.5354 mm	15.24 mm	15.24 mm	-

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