Dual-Port SRAM, 4KX18, 25ns, CMOS, PBGA100, 0.80 MM PITCH, FPBGA-100
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | BGA |
package instruction | LFBGA, |
Contacts | 100 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 25 ns |
JESD-30 code | S-PBGA-B100 |
JESD-609 code | e0 |
length | 10 mm |
memory density | 73728 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 18 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 4096 words |
character code | 4000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4KX18 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
Certification status | Not Qualified |
Maximum seat height | 1.5 mm |
Maximum supply voltage (Vsup) | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 10 mm |