Line Driver, 3 Func, 3 Driver, DIE
Parameter Name | Attribute value |
Maker | Cobham PLC |
package instruction | DIE, DIE OR CHIP |
Reach Compliance Code | unknown |
Differential output | YES |
Number of drives | 3 |
Input properties | STANDARD |
Interface integrated circuit type | LINE DRIVER |
Interface standards | GENERAL PURPOSE |
JESD-30 code | S-XUUC-N74 |
JESD-609 code | e0 |
Number of functions | 3 |
Number of terminals | 74 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | UNSPECIFIED |
encapsulated code | DIE |
Encapsulate equivalent code | DIE OR CHIP |
Package shape | SQUARE |
Package form | UNCASED CHIP |
power supply | 3.3 V |
Certification status | Qualified |
Filter level | MIL-PRF-38535 Class Q |
Maximum slew rate | 65 mA |
Maximum supply voltage | 3.6 V |
Minimum supply voltage | 3 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | NO LEAD |
Terminal location | UPPER |
total dose | 1M Rad(Si) V |
5962F0153402Q9A | 5962F0153402V9A | 5962R0153401V9A | 5962H0153402V9A | |
---|---|---|---|---|
Description | Line Driver, 3 Func, 3 Driver, DIE | Line Driver, 3 Func, 3 Driver, DIE | Line Driver, 3 Func, 3 Driver, DIE | Line Driver, 3 Func, 3 Driver, DIE |
Maker | Cobham PLC | Cobham PLC | Cobham PLC | Cobham PLC |
package instruction | DIE, DIE OR CHIP | DIE, DIE OR CHIP | DIE, DIE OR CHIP | DIE, DIE OR CHIP |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Differential output | YES | YES | YES | YES |
Number of drives | 3 | 3 | 3 | 3 |
Input properties | STANDARD | STANDARD | STANDARD | STANDARD |
Interface integrated circuit type | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER |
Interface standards | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE |
JESD-30 code | S-XUUC-N74 | S-XUUC-N74 | S-XUUC-N74 | S-XUUC-N74 |
JESD-609 code | e0 | e0 | e0 | e0 |
Number of functions | 3 | 3 | 3 | 3 |
Number of terminals | 74 | 74 | 74 | 74 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIE | DIE | DIE | DIE |
Encapsulate equivalent code | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Qualified | Qualified | Qualified | Qualified |
Filter level | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V |
Maximum slew rate | 65 mA | 65 mA | 65 mA | 65 mA |
Maximum supply voltage | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | UPPER | UPPER | UPPER | UPPER |
total dose | 1M Rad(Si) V | 1M Rad(Si) V | 100k Rad(Si) V | 1M Rad(Si) V |