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GD54HCT08J

Description
AND Gate, CMOS, CDIP14,
Categorylogic    logic   
File Size168KB,4 Pages
ManufacturerLG Semicon Co., Ltd.
Download Datasheet Parametric Compare View All

GD54HCT08J Overview

AND Gate, CMOS, CDIP14,

GD54HCT08J Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLG Semicon Co., Ltd.
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeAND GATE
MaximumI(ol)0.004 A
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Prop。Delay @ Nom-Sup36 ns
Certification statusNot Qualified
Schmitt triggerNO
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

GD54HCT08J Related Products

GD54HCT08J GD74HC08J GD74HC08D SLVU2.8-4 GD74HCT08 GD74HCT08D GD74HCT08J GD54HC08J
Description AND Gate, CMOS, CDIP14, AND Gate, CMOS, CDIP14, AND Gate, CMOS, PDSO14, 2.8V TVS Array For ESD and Latch-Up Protection AND Gate, CMOS, PDIP14, AND Gate, CMOS, PDSO14, AND Gate, CMOS, CDIP14, AND Gate, CMOS, CDIP14,
Is it Rohs certified? incompatible incompatible incompatible - incompatible incompatible incompatible incompatible
Reach Compliance Code unknown unknown unknown - unknown unknown unknown unknown
JESD-30 code R-XDIP-T14 R-XDIP-T14 R-PDSO-G14 - R-PDIP-T14 R-PDSO-G14 R-XDIP-T14 R-XDIP-T14
JESD-609 code e0 e0 e0 - e0 e0 e0 e0
Load capacitance (CL) 50 pF 50 pF 50 pF - 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type AND GATE AND GATE AND GATE - AND GATE AND GATE AND GATE AND GATE
MaximumI(ol) 0.004 A 0.004 A 0.004 A - 0.004 A 0.004 A 0.004 A 0.004 A
Number of terminals 14 14 14 - 14 14 14 14
Maximum operating temperature 125 °C 85 °C 85 °C - 85 °C 85 °C 85 °C 125 °C
Minimum operating temperature -55 °C -40 °C -40 °C - -40 °C -40 °C -40 °C -55 °C
Package body material CERAMIC CERAMIC PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC
encapsulated code DIP DIP SOP - DIP SOP DIP DIP
Encapsulate equivalent code DIP14,.3 DIP14,.3 SOP14,.25 - DIP14,.3 SOP14,.25 DIP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE - IN-LINE SMALL OUTLINE IN-LINE IN-LINE
power supply 5 V 2/6 V 2/6 V - 5 V 5 V 5 V 2/6 V
Prop。Delay @ Nom-Sup 36 ns 23 ns 23 ns - 30 ns 30 ns 30 ns 27 ns
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO - NO NO NO NO
surface mount NO NO YES - NO YES NO NO
technology CMOS CMOS CMOS - CMOS CMOS CMOS CMOS
Temperature level MILITARY INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING - THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm - 2.54 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL - DUAL DUAL DUAL DUAL
Base Number Matches - 1 1 - 1 1 1 -

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