GD74HC08J datasheet, PDF - EEWORLD Datasheet

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GD74HC08J: DescriptionAND Gate, CMOS, CDIP14,; Categorylogic logic; File Size168KB，4 Pages; ManufacturerLG Semicon Co., Ltd.

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GD74HC08J Overview

AND Gate, CMOS, CDIP14,

GD74HC08J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	AND GATE
MaximumI(ol)	0.004 A
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Prop。Delay @ Nom-Sup	23 ns
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

GD74HC08J Related Products

	GD74HC08J	GD74HC08D	SLVU2.8-4	GD74HCT08	GD74HCT08D	GD74HCT08J	GD54HCT08J	GD54HC08J
Description	AND Gate, CMOS, CDIP14,	AND Gate, CMOS, PDSO14,	2.8V TVS Array For ESD and Latch-Up Protection	AND Gate, CMOS, PDIP14,	AND Gate, CMOS, PDSO14,	AND Gate, CMOS, CDIP14,	AND Gate, CMOS, CDIP14,	AND Gate, CMOS, CDIP14,
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	-	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T14	R-PDSO-G14	-	R-PDIP-T14	R-PDSO-G14	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14
JESD-609 code	e0	e0	-	e0	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	-	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	AND GATE	AND GATE	-	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE
MaximumI(ol)	0.004 A	0.004 A	-	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Number of terminals	14	14	-	14	14	14	14	14
Maximum operating temperature	85 °C	85 °C	-	85 °C	85 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-55 °C	-55 °C
Package body material	CERAMIC	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	SOP	-	DIP	SOP	DIP	DIP	DIP
Encapsulate equivalent code	DIP14,.3	SOP14,.25	-	DIP14,.3	SOP14,.25	DIP14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	-	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE
power supply	2/6 V	2/6 V	-	5 V	5 V	5 V	5 V	2/6 V
Prop。Delay @ Nom-Sup	23 ns	23 ns	-	30 ns	30 ns	30 ns	36 ns	27 ns
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	-	NO	NO	NO	NO	NO
surface mount	NO	YES	-	NO	YES	NO	NO	NO
technology	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	-	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	-	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	-	1	1	1	-	-

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