CD4556BE98 datasheet, PDF - EEWORLD Datasheet

CD4556BE98: DescriptionCD4556BE98; Categorylogic logic; File Size646KB，10 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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CD4556BE98 Overview

CD4556BE98

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP16,.3
Reach Compliance Code	not_compliant
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	OTHER DECODER/DRIVER
MaximumI(ol)	0.00042 A
Number of functions	2
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
method of packing	TAPE AND REEL
power supply	5/15 V
Prop。Delay @ Nom-Sup	440 ns
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	CD4556BE98	CD4556BEX98	CD4555BEX98
Description	CD4556BE98	CD4556BEX98	CD4555BEX98
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	not_compliant	not_compliant	_compli
JESD-30 code	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF
Logic integrated circuit type	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER
MaximumI(ol)	0.00042 A	0.00042 A	0.00042 A
Number of functions	2	2	2
Number of terminals	16	16	16
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
method of packing	TAPE AND REEL	TAPE AND REEL	TR
power supply	5/15 V	5/15 V	5/15 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
Prop。Delay @ Nom-Sup	440 ns	440 ns	-

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