EEPROM, 64X16, Serial, CMOS, PDIP8, LEAD AND HALOGEN FREE, PLASTIC, DIP-8
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Catalyst |
Parts packaging code | DIP |
package instruction | DIP, DIP8,.3 |
Contacts | 8 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum clock frequency (fCLK) | 1 MHz |
Data retention time - minimum | 100 |
Durability | 1000000 Write/Erase Cycles |
JESD-30 code | R-PDIP-T8 |
JESD-609 code | e3 |
length | 9.59 mm |
memory density | 1024 bit |
Memory IC Type | EEPROM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 64 words |
character code | 64 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 105 °C |
Minimum operating temperature | -40 °C |
organize | 64X16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP8,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/5 V |
Certification status | Not Qualified |
Maximum seat height | 4.57 mm |
Serial bus type | SPI |
Maximum standby current | 0.000003 A |
Maximum slew rate | 0.003 mA |
Maximum supply voltage (Vsup) | 6 V |
Minimum supply voltage (Vsup) | 2.5 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | MATTE TIN |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
width | 7.62 mm |
Maximum write cycle time (tWC) | 10 ms |
write protect | HARDWARE/SOFTWARE |