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SZBZX84C12LT1

Description
12V, 0.225W, SILICON, BIDIRECTIONAL VOLTAGE REGULATOR DIODE, TO-236AB, PLASTIC PACKAGE-3
CategoryDiscrete semiconductor    diode   
File Size179KB,7 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet Parametric View All

SZBZX84C12LT1 Overview

12V, 0.225W, SILICON, BIDIRECTIONAL VOLTAGE REGULATOR DIODE, TO-236AB, PLASTIC PACKAGE-3

SZBZX84C12LT1 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerON Semiconductor
Parts packaging codeSOT-23
package instructionPLASTIC PACKAGE-3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time1 week
Other featuresUL RECOGNIZED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeTO-236AB
JESD-30 codeR-PDSO-G3
JESD-609 codee0
Number of components1
Number of terminals3
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)240
polarityBIDIRECTIONAL
Maximum power dissipation0.225 W
Certification statusNot Qualified
Nominal reference voltage12 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature30
Maximum voltage tolerance5.39%
Working test current5 mA
BZX84BxxxLT1,
BZX84CxxxLT1 Series,
SZBZX84BxxxLT1G,
SZBZX84CxxxLT1G Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Features
1
2
http://onsemi.com
3
Cathode
1
Anode
MARKING DIAGRAM
3
SOT−23
CASE 318
STYLE 8
xxx M
G
G
225 mW Rating on FR−4 or FR−5 Board
Zener Breakdown Voltage Range
2.4 V to 75 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (>16 kV) per Human Body Model
Tight Tolerance Series Available (See Page 4)
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
Pb−Free Packages are Available
Mechanical Characteristics
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
1
xxx
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
BZX84CxxxLT1
BZX84CxxxLT1G
SZBZX84xxxLT1G
BZX84CxxxLT3
BZX84CxxxLT3G
SZBZXCxxxLT3G
BZX84BxxxLT1
Package
SOT−23
Shipping
3000/Tape & Reel
SOT−23 3000/Tape & Reel
(Pb−Free)
SOT−23 3000/Tape & Reel
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
10,000/Tape &
Reel
10,000/Tape &
Reel
10,000/Tape &
Reel
3000/Tape & Reel
3000 / Tape &
Reel
3000 / Tape &
Reel
10,000 / Tape &
Reel
10,000/Tape &
Reel
260°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Total Power Dissipation on FR−5 Board,
(Note 1) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
Total Power Dissipation on Alumina
Substrate, (Note 2) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Symbol
P
D
R
qJA
P
D
R
qJA
T
J
, T
stg
Max
225
1.8
556
300
2.4
417
−65
to
+150
Unit
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
BZX84BxxxLT1G
SZBZX84BxxxLT1G
BZX84BxxxLT3
BZX84BxxxLT3G
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 X 0.75 X 0.62 in.
2. Alumina = 0.4 X 0.3 X 0.024 in., 99.5% alumina.
©
Semiconductor Components Industries, LLC, 2011
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
November, 2011
Rev. 14
1
Publication Order Number:
BZX84C2V4LT1/D

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