|
SN74LV14APWTE4 |
SN74LV14ADBRG4 |
SN74LV14ADBRE4 |
SN74LV14APWRG3 |
SN74LV14ARGYRG4 |
Description |
Inverters Hex Schmitt-Trigger Inverters |
Inverters Hex Schmitt Trigger Inverters |
Inverters Hex Schmitt-Trigger Inverters |
Hex Schmitt-Trigger Inverters 14-TSSOP -40 to 125 |
Hex Schmitt-Trigger Inverters 14-VQFN -40 to 125 |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
TSSOP |
SSOP |
SSOP |
TSSOP |
QFN |
package instruction |
TSSOP, TSSOP14,.25 |
SSOP, SSOP14,.3 |
SSOP, SSOP14,.3 |
TSSOP, TSSOP14,.25 |
HVQCCN, LCC14/18,.14SQ,20 |
Contacts |
14 |
14 |
14 |
14 |
14 |
Reach Compliance Code |
unknow |
unknow |
unknow |
compli |
compli |
series |
LV/LV-A/LVX/H |
LV/LV-A/LVX/H |
LV/LV-A/LVX/H |
LV/LV-A/LVX/H |
LV/LV-A/LVX/H |
JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
S-PQCC-N14 |
JESD-609 code |
e4 |
e4 |
e4 |
e3 |
e4 |
length |
5 mm |
6.2 mm |
6.2 mm |
5 mm |
3.5 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
INVERTER |
INVERTER |
INVERTER |
INVERTER |
INVERTER |
MaximumI(ol) |
0.006 A |
0.006 A |
0.006 A |
0.012 A |
0.012 A |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
2 |
Number of functions |
6 |
6 |
6 |
6 |
6 |
Number of entries |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
14 |
14 |
14 |
14 |
14 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
SSOP |
SSOP |
TSSOP |
HVQCCN |
Encapsulate equivalent code |
TSSOP14,.25 |
SSOP14,.3 |
SSOP14,.3 |
TSSOP14,.25 |
LCC14/18,.14SQ,20 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
SQUARE |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
method of packing |
TR |
TAPE AND REEL |
TAPE AND REEL |
TR |
TR |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
power supply |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
Prop。Delay @ Nom-Su |
18.5 ns |
18.5 ns |
18.5 ns |
18.5 ns |
18.5 ns |
propagation delay (tpd) |
27 ns |
27 ns |
27 ns |
27 ns |
27 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Schmitt trigger |
YES |
YES |
YES |
YES |
YES |
Maximum seat height |
1.2 mm |
2 mm |
2 mm |
1.2 mm |
1 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
2 V |
2 V |
2 V |
2 V |
2 V |
Nominal supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Matte Tin (Sn) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
NO LEAD |
Terminal pitch |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.5 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
4.4 mm |
5.3 mm |
5.3 mm |
4.4 mm |
3.5 mm |