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SN74LV14APWTE4

Description
Inverters Hex Schmitt-Trigger Inverters
Categorylogic    logic   
File Size674KB,18 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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SN74LV14APWTE4 Overview

Inverters Hex Schmitt-Trigger Inverters

SN74LV14APWTE4 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeTSSOP
package instructionTSSOP, TSSOP14,.25
Contacts14
Reach Compliance Codeunknow
seriesLV/LV-A/LVX/H
JESD-30 codeR-PDSO-G14
JESD-609 codee4
length5 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeINVERTER
MaximumI(ol)0.006 A
Humidity sensitivity level1
Number of functions6
Number of entries1
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTR
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Su18.5 ns
propagation delay (tpd)27 ns
Certification statusNot Qualified
Schmitt triggerYES
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width4.4 mm

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Description Inverters Hex Schmitt-Trigger Inverters Inverters Hex Schmitt Trigger Inverters Inverters Hex Schmitt-Trigger Inverters Hex Schmitt-Trigger Inverters 14-TSSOP -40 to 125 Hex Schmitt-Trigger Inverters 14-VQFN -40 to 125
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code TSSOP SSOP SSOP TSSOP QFN
package instruction TSSOP, TSSOP14,.25 SSOP, SSOP14,.3 SSOP, SSOP14,.3 TSSOP, TSSOP14,.25 HVQCCN, LCC14/18,.14SQ,20
Contacts 14 14 14 14 14
Reach Compliance Code unknow unknow unknow compli compli
series LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 S-PQCC-N14
JESD-609 code e4 e4 e4 e3 e4
length 5 mm 6.2 mm 6.2 mm 5 mm 3.5 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type INVERTER INVERTER INVERTER INVERTER INVERTER
MaximumI(ol) 0.006 A 0.006 A 0.006 A 0.012 A 0.012 A
Humidity sensitivity level 1 1 1 1 2
Number of functions 6 6 6 6 6
Number of entries 1 1 1 1 1
Number of terminals 14 14 14 14 14
Maximum operating temperature 85 °C 85 °C 85 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SSOP SSOP TSSOP HVQCCN
Encapsulate equivalent code TSSOP14,.25 SSOP14,.3 SSOP14,.3 TSSOP14,.25 LCC14/18,.14SQ,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
method of packing TR TAPE AND REEL TAPE AND REEL TR TR
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Su 18.5 ns 18.5 ns 18.5 ns 18.5 ns 18.5 ns
propagation delay (tpd) 27 ns 27 ns 27 ns 27 ns 27 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger YES YES YES YES YES
Maximum seat height 1.2 mm 2 mm 2 mm 1.2 mm 1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2 V 2 V 2 V 2 V 2 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING GULL WING NO LEAD
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 4.4 mm 5.3 mm 5.3 mm 4.4 mm 3.5 mm
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