PD-90887H
IRHM7054
JANSR2N7394
RADIATION HARDENED
POWER MOSFET
THRU-HOLE (TO-254AA)
Product Summary
Part Number
IRHM7054
IRHM3054
IRHM4054
IRHM8054
Radiation Level
100 kRads(Si)
300 kRads(Si)
500 kRads(Si)
1000 kRads(Si)
RDS(on)
0.027
0.027
0.027
0.040
I
D
35A*
35A*
35A*
35A*
QPL Part Number
JANSR2N7394
JANSF2N7394
JANSG2N7394
JANSH2N7394
TO-254
60V, N-CHANNEL
REF: MIL-PRF-19500/603
RAD-Hard HEXFET TECHNOLOGY
Description
IR HiRel RAD-Hard HEXFET technology provides high performance
power MOSFETs for space applications. This technology
has over a decade of proven performance and reliability in
satellite applications. These devices have been characterized
for both Total Dose and Single Event Effects (SEE). The
combination of low Rdson and low gate charge reduces
the power losses in switching applications such as DC to
DC converters and motor control. These devices retain all
of the well established advantages of MOSFETs such as
voltage control, fast switching, ease of paralleling and
temperature stability of electrical parameters.
Features
Single Event Effect (SEE) Hardened
Low RDS(on)
Low Total Gate Charge
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
Electrically Isolated
Ceramic Eyelets
Light Weight
ESD Rating: Class 3A per MIL-STD-750,
Method 1020
Absolute Maximum Ratings
Parameter
I
D
@ V
GS
= 12V, T
C
= 25°C
I
DM
P
D
@T
C
= 25°C
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
Continuous Drain Current
Pulsed Drain Current
Maximum Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Lead Temperature
Weight
*Current is limited by package
For Footnotes refer to the page 2.
1
35*
30
140
150
1.2
± 20
500
35
15
3.5
-55 to + 150
I
D
@ V
GS
= 12V, T
C
= 100°C Continuous Drain Current
Pre-Irradiation
Units
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
300 (0.063 in. /1.6 mm from case for 10s)
9.3 (Typical)
g
2016-07-01
IRHM7054
JANSR2N7394
Pre-Irradiation
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter
BV
DSS
BV
DSS
/T
J
R
DS(on)
V
GS(th)
Gfs
I
DSS
I
GSS
Q
G
Q
GS
Q
GD
t
d(on)
tr
t
d(off)
t
f
Ls +L
D
C
iss
C
oss
C
rss
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-State
Resistance
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Min. Typ. Max. Units
60
–––
–––
–––
2.0
12
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
––– –––
0.053 –––
––– 0.027
––– 0.030
–––
4.0
––– –––
–––
25
––– 250
––– 100
––– -100
––– 200
–––
60
–––
75
–––
27
––– 100
–––
75
–––
75
6.8
4100
2000
560
–––
–––
–––
–––
V
V/°C
V
S
µA
nA
nC
Test Conditions
V
GS
= 0V, I
D
= 1.0mA
Reference to 25°C, I
D
= 1.0mA
V
GS
= 12V, I
D
= 30A
V
GS
= 12V, I
D
= 35A*
V
DS
= V
GS
, I
D
= 1.0mA
V
DS
= 15V, I
D
= 30A
V
DS
= 48V, V
GS
= 0V
V
DS
= 48V,V
GS
= 0V,T
J
=125°C
V
GS
= 20V
V
GS
= -20V
I
D
= 35A
V
DS
= 30V
V
GS
= 12V
V
DD
= 30V
I
D
= 35A
R
G
= 2.35
V
GS
= 12V
Measured from Drain lead (6mm / 0.25 in
from package) to Source lead (6mm/ 0.25
in from package) with Source wire internally
bonded from Source pin to Drain pad
ns
nH
V
GS
= 0V
pF
V
DS
= 25V
ƒ = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Parameter
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
Continuous Source Current (Body Diode)
Pulsed Source Current (Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Min. Typ. Max. Units
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
35*
140
1.4
280
2.2
A
V
ns
µC
Test Conditions
T
J
= 25°C,I
S
= 35A, V
GS
= 0V
T
J
= 25°C, I
F
= 35A, V
DD
≤
50V
di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
* Current is limited by package
Thermal Resistance
Parameter
R
JC
R
CS
R
JA
Junction-to-Case
Case -to-Sink
Junction-to-Ambient (Typical socket mount)
Min.
–––
–––
–––
Typ.
–––
0.21
–––
Max.
0.83
–––
48
Units
°C/W
Footnotes:
Repetitive Rating; Pulse width limited by maximum junction temperature.
DD
= 25V, starting T
J
= 25°C, L =0.9mH, Peak I
L
= 35A, V
GS
= 12V
V
I
SD
35A, di/dt
150A/µs, V
DD
60V, T
J
150°C
Pulse width
300 µs; Duty Cycle
2%
Total Dose Irradiation with V
GS
Bias.
12 volt V
GS
applied and V
DS
= 0 during irradiation per MIL-STD-750, Method 1019, condition A.
Total Dose Irradiation with V
DS
Bias.
48 volt V
DS
applied and V
GS
= 0 during irradiation per MlL-STD-750, Method 1019, condition A.
2
2016-07-01
IRHM7054
JANSR2N7394
Radiation Characteristics
Pre-Irradiation
IR HiRel Radiation Hardened MOSFETs are tested to verify their radiation hardness capability. The hardness assurance
program at IR Hirel is comprised of two radiation environments. Every manufacturing lot is tested for total ionizing dose
(per notes 5 and 6) using the TO-3 package. Both pre- and post-irradiation performance are tested and specified using
the same drive circuitry and test conditions in order to provide a direct comparison.
Table1. Electrical Characteristics @ Tj = 25°C, Post Total Dose Irradiation
Parameter
BV
DSS
V
GS(th)
I
GSS
I
GSS
I
DSS
R
DS(on)
R
DS(on)
V
SD
Drain-to-Source Breakdown Voltage
Gate Threshold Voltage
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Zero Gate Voltage Drain Current
Static Drain-to-Source
On-State Resistance (TO-3)
Static Drain-to-Source
On-State Resistance (TO-254AA)
Diode Forward Voltage
Up to 500 kRads (Si)
1
1000 kRads (Si)
2
Min.
60
2.0
–––
–––
–––
–––
–––
–––
Max.
–––
4.0
100
-100
25
0.027
0.027
1.4
Min.
60
1.25
–––
–––
–––
–––
–––
–––
Max.
–––
4.5
100
-100
50
0.040
0.040
1.4
V
V
nA
nA
µA
V
V
GS
= 0V, I
D
= 1.0mA
V
DS
= V
GS
, I
D
= 1.0mA
V
GS
= 20V
V
GS
= -20V
V
DS
= 48V, V
GS
= 0V
V
GS
= 12V, I
D
= 30A
V
GS
= 12V, I
D
= 30A
V
GS
= 0V, I
D
= 35A
Units
Test Conditions
1. Part numbers IRHM7054 (JANSR2N7394), IRHM3054 (JANSF2N7394) and IRHM4054 (JANSG2N7394)
2. Part number IRHM8054 (JANSH2N7394)
IR HiRel radiation hardened MOSFETs have been characterized in heavy ion environment for Single Event Effects
(SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2.
Table 2. Typical Single Event Effect Safe Operating Area
Ion
Br
I
LET
(MeV/(mg/cm
2
))
36.8
59.9
Energy
(MeV)
305
345
Range
(µm)
39
32.8
VDS (V)
@VGS=0V
60
40
@VGS=-5V
60
35
@VGS=-10V @VGS=-15V @VGS=-20V
45
30
40
25
30
20
70
60
50
VDS
40
30
20
10
0
0
-5
-10
VGS
-15
-20
BR
I
Fig a.
Typical Single Event Effect, Safe Operating Area
For Footnotes, refer to the page 2.
3
2016-07-01
IRHM7054
JANSR2N7394
Pre-Irradiation
1000
1000
I
D
, Drain-to-Source Current (A)
I
D
, Drain-to-Source Current (A)
VGS
TOP
15V
12V
10V
9.0V
8.0V
7.0V
6.0V
BOTTOM 5.0V
VGS
15V
12V
10V
9.0V
8.0V
7.0V
6.0V
BOTTOM 5.0V
TOP
100
100
5.0V
10
1
10
20µs PULSE WIDTH
T
J
= 25
°
C
100
5.0V
10
1
10
20µs PULSE WIDTH
T
J
= 150
°
C
100
V
DS
, Drain-to-Source Voltage (V)
V
DS
, Drain-to-Source Voltage (V)
Fig 1.
Typical Output Characteristics
1000
2.5
Fig 2.
Typical Output Characteristics
I
D
= 50A
R
DS(on)
, Drain-to-Source On Resistance
(Normalized)
I
D
, Drain-to-Source Current (A)
2.0
T
J
= 25
°
C
100
1.5
T
J
= 150
°
C
1.0
0.5
10
V DS = 25V
20µs PULSE WIDTH
5
6
7
8
9
10
11
12
0.0
-60 -40 -20
V
GS
= 12V
0
20
40
60
80
100 120 140 160
V
GS
, Gate-to-Source Voltage (V)
T
J
, Junction Temperature
(
°
C)
Fig 3.
Typical Transfer Characteristics
8000
Fig 4.
Normalized On-Resistance Vs. Temperature
20
V
GS
, Gate-to-Source Voltage (V)
V
GS
C
iss
C
rss
C
oss
=
=
=
=
0V,
f = 1MHz
C
gs
+ C
gd ,
C
ds
SHORTED
C
gd
C
ds
+ C
gd
I
D
= 35A
V
DS
= 48V
V
DS
= 30V
16
C, Capacitance (pF)
6000
Ciss
4000
12
Coss
2000
8
Crss
0
4
1
10
100
0
FOR TEST CIRCUIT
SEE FIGURE 13
0
40
80
120
160
200
V
DS
, Drain-to-Source Voltage (V)
Q
G
, Total Gate Charge (nC)
Fig 5.
Typical Capacitance Vs.
Drain-to-Source Voltage
4
Fig 6.
Typical Gate Charge Vs.
Gate-to-Source Voltage
2016-07-01
IRHM7054
JANSR2N7394
Pre-Irradiation
1000
1000
OPERATION IN THIS AREA LIMITED
BY R DS(on)
100
100
s
1ms
I
SD
, Reverse Drain Current (A)
T
J
= 25
°
C
100
T
J
= 150
°
C
ID, Drain-to-Source Current (A)
10
10
Tc = 25°C
Tj = 150°C
Single Pulse
1
10
VDS , Drain-to-Source Voltage (V)
10ms
DC
1
0.4
V
GS
= 0 V
1.0
1.6
2.2
2.8
3.4
4.0
1
V
SD
,Source-to-Drain Voltage (V)
100
Fig 7.
Typical Source-Drain Diode Forward Voltage
50
Fig 8.
Maximum Safe Operating Area
LIMITED BY PACKAGE
40
I
D
, Drain Current (A)
30
20
10
0
25
50
75
100
125
150
T
C
, Case Temperature
( °C)
Fig 9.
Maximum Drain Current Vs. Case Temperature
Fig 10.
Maximum Avalanche Energy
Vs. Drain Current
1
D = 0.50
Thermal Response (Z
thJC
)
0.20
0.1
0.10
0.05
0.02
0.01
SINGLE PULSE
(THERMAL RESPONSE)
P
DM
t
1
t
2
Notes:
1. Duty factor D =t
1
/ t
2
2. Peak T
J
= P
DM
x Z
thJC
+ T
C
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
t
1
, Rectangular Pulse Duration (sec)
Fig 11.
Maximum Effective Transient Thermal Impedance, Junction-to-Case
5
2016-07-01