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ELJPE12NKFA

Description
1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
CategoryPassive components    inductor   
File Size223KB,7 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
Environmental Compliance
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ELJPE12NKFA Overview

1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD

ELJPE12NKFA Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerPanasonic
package instruction0603
Reach Compliance Codecompli
ECCN codeEAR99
uppercase and lowercase codes0603
structureChi
core materialCERAMIC
DC Resistance0.08 Ω
Nominal inductance(L)0.012 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee3
Number of functions1
Number of terminals2
Maximum operating temperature85 °C
Minimum operating temperature-20 °C
Package height0.8 mm
Package length1.6 mm
Package formSMT
Package width0.8 mm
method of packingTR
Minimum quality factor (at nominal inductance)9
Maximum rated current1.3 A
self resonant frequency2500 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceTin (Sn)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency100 MHz
Tolerance10%
Base Number Matches1
Fixed Inductors (Chip Inductors)
4. High Power Type PF, PE, PC, PA, PB
Features
Low DCR and large current capability, suitable for power circuitry.
Wire wound, resin molded chip inductor. (PC, PA, PB types)
Unique Ceramic Core/Laser-cut technology (PF, PE type)
Capable of being Re-flow or flow soldered.
Wide line-up from 1005 to 4532 case sizes.
Good for mounting.
Recommended Applications
AV equipment, Wireless communication equipment and various types of general electronic equipment.
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
L
J
P
A
1
R
5
K
F
Packaging Design No.
Product code
Chip Inductors
PF
PE
PC
PA
PB
Shape
1005 (0402)
1608 (0603)
2520 (1008)
3225 (1210)
4532 (1812)
Inductance
1N5
10N
R22
3R3
470
561
1.5 nH
10 nH
220 nH
3.3
µH
47
µH
560
µH
Inductance tolerance
D
J
K
M
±0.3
nH
±5
%
±10
%
±20
%
F
Taping
Size : mm (inch)
■Storage
Conditions
: Normal temperature (–5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to
direct sunlight and harmful gases and care should be taken so as not to cause dew.
Operating Temperature : –20 to +85 °C
Package
■Storage
Period
Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation
of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.
■Packaging
■Soldering
Conditions
■Safety
Precautions
Refer 27 and 28 page.
Refer 29 page.
Refer 30 page.
Jul. 2008
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.

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