FIFO, 256X9, 50ns, Asynchronous, CMOS, PDIP28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| package instruction | DIP, DIP28,.3 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 50 ns |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of terminals | 28 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256X9 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.005 A |
| Maximum slew rate | 0.06 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| 67C4500-50NS | 67C4500-35NS | 67C4500-65NS | 67C4500-80NS | |
|---|---|---|---|---|
| Description | FIFO, 256X9, 50ns, Asynchronous, CMOS, PDIP28 | FIFO, 256X9, 35ns, Asynchronous, CMOS, PDIP28 | FIFO, 256X9, 65ns, Asynchronous, CMOS, PDIP28 | FIFO, 256X9, 80ns, Asynchronous, CMOS, PDIP28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | AMD | AMD |
| package instruction | DIP, DIP28,.3 | DIP, DIP28,.3 | DIP, DIP28,.3 | DIP, DIP28,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 50 ns | 35 ns | 65 ns | 80 ns |
| JESD-30 code | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 9 | 9 | 9 | 9 |
| Number of terminals | 28 | 28 | 28 | 28 |
| word count | 256 words | 256 words | 256 words | 256 words |
| character code | 256 | 256 | 256 | 256 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256X9 | 256X9 | 256X9 | 256X9 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP28,.3 | DIP28,.3 | DIP28,.3 | DIP28,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.005 A | 0.005 A | 0.005 A | 0.005 A |
| Maximum slew rate | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
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