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SST39WF400B-70-4I-CAQE

Description
256K X 16 FLASH 1.8V PROM, 70 ns, PBGA48, 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CZB-4, FLGA-48
Categorystorage    storage   
File Size830KB,25 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance  
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SST39WF400B-70-4I-CAQE Overview

256K X 16 FLASH 1.8V PROM, 70 ns, PBGA48, 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CZB-4, FLGA-48

SST39WF400B-70-4I-CAQE Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeDSBGA
package instructionVFLGA,
Contacts48
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time70 ns
JESD-30 codeR-PBGA-B48
JESD-609 codee3
length6 mm
memory density4194304 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals48
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFLGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height0.52 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formBUTT
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
typeNOR TYPE
width5 mm
4 Mbit (x16) Multi-Purpose Flash
SST39WF400B
Data Sheet
FEATURES:
• Organized as 256K x16
• Single Voltage Read and Write Operations
– 1.65-1.95V
• Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
• Low Power Consumption (typical values at 5 MHz)
– Active Current: 5 mA (typical)
– Standby Current: 5 µA (typical)
• Sector-Erase Capability
– Uniform 2 KWord sectors
• Block-Erase Capability
– Uniform 32 KWord blocks
• Fast Read Access Time
– 70 ns
• Latched Address and Data
• Fast Erase and Word-Program
– Sector-Erase Time: 36 ms (typical)
– Block-Erase Time: 36 ms (typical)
– Chip-Erase Time: 140 ms (typical)
– Word-Program Time: 28 µs (typical)
• Automatic Write Timing
– Internal V
PP
Generation
• End-of-Write Detection
– Toggle Bit
– Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pinouts and command sets
• Packages Available
– 48-ball TFBGA (6mm x 8mm)
– 48-ball WFBGA (4mm x 6mm) Micro-Package
– 48-ball XFLGA (4mm x 6mm) Micro-Package
• All non-Pb (lead-free) devices are RoHS compliant
PRODUCT DESCRIPTION
The SST39WF400B is a 256K x16 CMOS Multi-Purpose
Flash (MPF) manufactured with SST proprietary, high-per-
formance CMOS SuperFlash technology. The split-gate
cell design and thick-oxide tunneling injector attain better
reliability and manufacturability compared to alternate
approaches. The SST39WF400B writes (Program or
Erase) with a 1.65-1.95V power supply. This device con-
forms to JEDEC standard pin assignments for x16 memo-
ries.
The SST39WF400B features high-performance Word-Pro-
gramming which provides a typical Word-Program time of
28 µsec. It uses Toggle Bit or Data# Polling to detect the
completion of the Program or Erase operation. On-chip
hardware and software data protection schemes protect
against inadvertent writes. Designed, manufactured, and
tested for a wide spectrum of applications, the
SST39WF400B is offered with a guaranteed typical endur-
ance of 100,000 cycles. Data retention is rated at greater
than 100 years.
The SST39WF400B is suited for applications that require
convenient and economical updating of program, configu-
ration, or data memory. For all system applications, this
MPF significantly improves performance and reliability,
while lowering power consumption. It inherently uses less
©2010 Silicon Storage Technology, Inc.
S71370-02-000
01/10
1
energy during Erase and Program than alternative flash
technologies. When programming a flash device, the total
energy consumed is a function of the applied voltage, cur-
rent, and time of application. For any given voltage range,
SuperFlash technology uses less current to program and
has a shorter erase time; therefore, the total energy con-
sumed during any Erase or Program operation is less than
alternative flash technologies. These devices also improve
flexibility while lowering the cost for program, data, and con-
figuration storage applications.
SuperFlash technology provides fixed Erase and Program
times independent of the number of Erase/Program cycles
that have occurred. Consequently, the system software or
hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose Erase
and Program times increase with accumulated Erase/Pro-
gram cycles.
To meet surface mount requirements, the SST39WF400B
is offered in 48-ball TFBGA, 48-ball WFBGA, and a 48-ball
XFLGA packages. See Figures 2 and 3 for pin assign-
ments and Table 2 for pin descriptions.
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
MPF is a trademark of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.

SST39WF400B-70-4I-CAQE Related Products

SST39WF400B-70-4I-CAQE SST39WF400B-70-4C-CAQE
Description 256K X 16 FLASH 1.8V PROM, 70 ns, PBGA48, 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CZB-4, FLGA-48 256K X 16 FLASH 1.8V PROM, 70 ns, PBGA48, 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CZB-4, FLGA-48
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker Microchip Microchip
Parts packaging code DSBGA DSBGA
package instruction VFLGA, VFLGA,
Contacts 48 48
Reach Compliance Code compliant compliant
ECCN code EAR99 EAR99
Maximum access time 70 ns 70 ns
JESD-30 code R-PBGA-B48 R-PBGA-B48
JESD-609 code e3 e3
length 6 mm 6 mm
memory density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
memory width 16 16
Number of functions 1 1
Number of terminals 48 48
word count 262144 words 262144 words
character code 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C
organize 256KX16 256KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFLGA VFLGA
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260
Programming voltage 1.8 V 1.8 V
Certification status Not Qualified Not Qualified
Maximum seat height 0.52 mm 0.52 mm
Maximum supply voltage (Vsup) 1.95 V 1.95 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL
Terminal surface MATTE TIN MATTE TIN
Terminal form BUTT BUTT
Terminal pitch 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 40 40
type NOR TYPE NOR TYPE
width 5 mm 5 mm

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