Line Driver/Receiver, CMOS, PDIP24,
Parameter Name | Attribute value |
Maker | Cobham PLC |
package instruction | DIP, DIP24,.6 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDIP-T24 |
Number of terminals | 24 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 4.5 V |
Certification status | Not Qualified |
Maximum slew rate | 2.6 mA |
Nominal supply voltage | 4.5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
MT72038D-BI | MT72038D | MT72038D-C | MT72038JZ3 | MT72038JZ | |
---|---|---|---|---|---|
Description | Line Driver/Receiver, CMOS, PDIP24, | Line Driver/Receiver, CMOS, PDIP24, | Line Driver/Receiver, CMOS, PDIP24, | Line Driver/Receiver, CMOS, PQCC28, | Line Driver/Receiver, CMOS, PQCC28, |
Maker | Cobham PLC | Cobham PLC | Cobham PLC | Cobham PLC | Cobham PLC |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
Number of terminals | 24 | 24 | 24 | 28 | 28 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | QCCJ | QCCJ |
Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 | LDCC28(UNSPEC) | LDCC28(UNSPEC) |
Package form | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
power supply | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum slew rate | 2.6 mA | 2.6 mA | 2.6 mA | 2.6 mA | 2.6 mA |
Nominal supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
surface mount | NO | NO | NO | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
Terminal location | DUAL | DUAL | DUAL | QUAD | QUAD |
package instruction | DIP, DIP24,.6 | - | DIP, DIP24,.6 | QCCJ, LDCC28(UNSPEC) | QCCJ, LDCC28(UNSPEC) |
JESD-30 code | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | - | - |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | - | - |