PKF series
PKF series
General information
• SMD and through hole versions with
ultra-low component height 8.0 mm
(0.315 in.)
• Up to 87% efficiency at full load
• Safety requirements in accordance
with EN60950
• MTTF >10 million hours at +50°C case
temperature (+40°C ambient)
• Low EMI
Patents
US: D357901 DE: M94022763
The MacroDens™ PKF family of true component
level on-board DC/DC power modules are intended
as distributed power sources in decentralized power
systems. Utilization of thick film technology and a
high degree of silicon integration has made it possible
to achieve a MTTF of more than 10 million hours.
The high reliability and the very low heights of these
DC/DC power modules makes them particularly
suited for Information Technology and Telecom
(IT&T) applications, with board spacing down to
15 mm or 0.6 in. They are optimized for an
operational ambient temperature range in compliance
with present and future application needs, including
non temperature controlled environments. The
mechanical design offers surface mount and through-
hole versions, delivered in ready-to-use tubes, trays or
tape & reel packages, and compatibility with semi and
fully aqueous cleaning processes. The PKF series is
manufactured in highly automated production lines
using SMT, laser trimming, 100% burn-in and ATE
final inspection.
Ericsson Microelectronics AB has been an ISO 9001
certified supplier since 1991. For a complete product
program please reference the back cover.
E
Environmental Characteristics
Characteristics
Test procedure & conditions
Frequency
Amplitude
Acceleration
Number of cycles
Frequency
Acceleration density
spectrum
Duration
Reproducability
Peak acceleration
Shock duration
Temperature
Humidity
Duration
Temperature
Number of cycles
Duration
Temperature
Temperature, solder
Duration
Temperature
Duration
Number of cycles
10…500 Hz
0.75 mm
10 g
10 in each axis
10…500 Hz
0.5 g
2
/Hz
10 min in 3 directions
medium (IEC 62-36)
200 g
3 ms
85°C
85% RH
1000 hours
–40°C…+125°C
500
96 h
35°C
260°C
10...13 s
125°C
1000hrs
2
Vibration
(Sinusoidal)
JESD 22-B103
(IEC 68-2-6 F
c)
Random
vibration
MIL-STD-883
Method 2026
(IEC 68-2-34 E
d)
JESD 22-A104
(IEC 68-2-14 N
a)
JESD 22-A101
(IEC 68-2-3 C
a
with bias)
JESD 22-B104
(IEC 68-2-27 E
a)
JESD 22-A-A107
(IEC 68-2-11 K
a
)
JESD 22-B106
(IEC 68-2-20 T
b
1A)
JESD22-A10
JESD22-B105
JESD22-B102
Shock
(Half sinus)
Temperature
change
Accelerated
damp heat
Aggressive
environment
Resistance to
soldering temp
1) 2)
High temp
Storage life
Lead Integrity
Solderability
Operational
life test
Temperature
Maximum load
Input voltage on
Input voltage off
Duration
J-STD-020
Level 1
85°C
9min
3min
1000hrs
Moisture reflow
Senitive classification
1)
2)
Applies to through-hole versions
For surfacemount versions please see soldering profile page 4.
2
EN/LZT 146 57 R1A © Ericsson Microelectronics AB, March 2001
Mechanical Data
Through-hole version
Surface-mount version
Foot print Component side
Foot print Component side
1
2
3
4
5
6
7
8
9
3.6[0.142]
5.0[0.197]
40.0[1.575]
Dimensions in mm (in)
Dimensions in mm (in)
Weight
Maximum 20 g (0.71 oz).
Case
The case consists of semiconductor grade
epoxy with embedded pins.
Coefficient of thermal expansion (CTE) is typ.
15 ppm/°C.
Connection Pins
Base material is copper (Cu), first plating is
nickel (Ni) and second (outer) plating is
palladium (Pd).
24.0[0.945]
29.6[ 1.165]
18 17 16 15 14 13 12 11 10
2.8[0.110]
Dimensions in mm (in)
EN/LZT 146 57 R1A © Ericsson Microelectronics AB, March 2001
3
Thermal Data
Two-parameter model
This model provides a more precise description of the thermal char-
acteristics to be used for thermal calculations.
Thermally the power module can be considered as a component and
the case temperature can be used to characterize the properties. The
thermal data for a power module with the substrate in contact with
the case can be described with two thermal resistances. One from
case to ambient air and one from case to PB (Printed circuit Board).
The thermal characteristics temperature can be calculated from the
following formula:
T
PB
= (T
C
–T
A
)×(R
th C–PB
+R
th C–A
)/R
th C–A
–P
d
×R
th C–PB
+T
A
dissipated power, calculated as P
O
×(l/h–1)
max average case temperature
ambient air temperature at the lower side of the
power module
temperature in the PB between the PKF connection pins
T
PB
:
R
th C-PB
: thermal resistance from case to PB under the
power module
R
th C-A
: thermal resistance from case to ambient air
v:
velocity of ambient air
R
th C-PB
is constant and R
th C-A
is dependent on the air velocity.
Free convection is equal to an air velocity of aprox. 0.2 – 0.3 m/s.
See figure below.
Where:
P
d
:
T
C
:
T
A
:
Reflow Soldering Information
The PKF series of DC/DC power modules are manufactured in sur-
face mount technology. Extra precautions must therefore be taken
when reflow soldering the surface mount version. Neglecting the
soldering information given below may result in permanent damage
or significant degradation of power module performance.
The PKF series can be reflow soldered using IR, Natural Convection,
Forced Convection or Combined IR/Convection Technologies. The
high thermal mass of the component and its effect on
DT
(°C) re-
quires that particular attention be paid to other temperature sensi-
tive components.
IR Reflow technology may require the overall profile time to be
extended to approximately 8–10 minutes to ensure an acceptable
DT.
Higher activity flux may be more suitable to overcome the
increase in oxidation and to avoid flux burn-up.
The general profile parameters detailed in the diagram, with this ex-
tended time to reach peak temperatures, would then be suitable.
Note!
These are maximum parameters. Depending on process varia-
tions, an appropriate margin must be added.
Figure 4
11
Palladium plating is used on the terminal pins. A pin temperature (T
p
)
in excess of the solder fusing temperature (+183°C for Sn/Pb 63/37)
for more than 25 seconds and a peak temperature above 195°C, is
required to guarantee a reliable solder joint.
Both pin 1 and pin 11 must be monitored.
No responsibility is assumed if these recommendations are not
strictly followed.
4
11
EN/LZT 146 57 R1A © Ericsson Microelectronics AB, March 2001
Delivery Package Information
Tubes
The PKF-series is delivered in tubes (designated by /A) with a
length of 500 mm (19.69 in), see fig. 2.
Capacity:
Stacking pitch:
Weight:
Min. order quantity:
15 power modules/tray
10.16 mm
Typ. 130 g
150 pcs (one box contains 10 full trays)
Tape & Reel
SMD versions, SI, can be delivered in standard tape & reel package
(designated by /C) on request, see fig. 4. For more information, please
contact your local Ericsson sales office.
24
(0.95)
9.5
(0.37)
11
(0.43)
14.5
(0.57)
15
(0.59)
35
(1.38)
All dimensions in mm (in)
1.1
(0.04)
Figure 2
Specification
Material:
Antistatic coated PVC
Max surface resistance: 10
11
W/
Color:
Transparent
Capacity:
10 power modules/tube
Weight:
Typ. 60 g
End stops:
Pins
Trays
SMD versions, SI, can be delivered in standard JEDEC trays (desig-
nated by /B) on request, see fig. 3. For more information, please
contact your local Ericsson sales office.
Figure 4
Specification
Tape material:
Tape width:
Tape pitch:
Max surface resistance:
Tape color:
Cover tape color:
Reel diameter:
Reel hub diameter:
Reel capacity:
Full reel weight:
Min. order quantity:
Conductive polystyrene (PS)
72 mm
36 mm
10
5
W
/
Black
Transparent
13"
4"
150 power modules/reel
Typ. 3.7 kg
300 pcs (one box contains two reels)
Figure 3
Specification
Material:
Max temperature:
Max surface resistance:
Color:
Polypropylene (PP)
125ºC
10
5
W/
Black
EN/LZT 146 57 R1A © Ericsson Microelectronics AB, March 2001
5
京公网安备 11010802033920号
EEWORLD
