|
ADG1412YCPZ-REEL7 |
1206B122K102NB |
ADG1412YCPZ-REEL |
ADG1413YCPZ-REEL7 |
ADG1413YCPZ-REEL |
ADG1411YRUZ |
ADG1411YRUZ-REEL7 |
ADG1412YRUZ-REEL7 |
ADG1413YRUZ |
Description |
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC16, 4 X 4 MM, ROHS COMPLIANT, MO-220VGGC, LFCSP-16 |
Ceramic Capacitor, Ceramic, 1000V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.0012uF, 1206, |
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC16, 4 X 4 MM, ROHS COMPLIANT, MO-220VGGC, LFCSP-16 |
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC16, 4 X 4 MM, ROHS COMPLIANT, MO-220VGGC, LFCSP-16 |
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC16, 4 X 4 MM, ROHS COMPLIANT, MO-220VGGC, LFCSP-16 |
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, ROHS COMPLIANT, MO-153AB, TSSOP-16 |
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, ROHS COMPLIANT, MO-153AB, TSSOP-16 |
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, ROHS COMPLIANT, MO-153AB, TSSOP-16 |
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, ROHS COMPLIANT, MO-153AB, TSSOP-16 |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
package instruction |
HVQCCN, |
, 1206 |
HVQCCN, |
HVQCCN, |
HVQCCN, |
TSSOP, |
TSSOP, |
TSSOP, |
TSSOP, |
Reach Compliance Code |
unknown |
compliant |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
length |
4 mm |
3.2 mm |
4 mm |
4 mm |
4 mm |
5 mm |
5 mm |
5 mm |
5 mm |
Number of terminals |
16 |
2 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-55 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMT |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
width |
4 mm |
1.6 mm |
4 mm |
4 mm |
4 mm |
4.4 mm |
4.4 mm |
4.4 mm |
4.4 mm |
Is it lead-free? |
Lead free |
- |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Maker |
Rochester Electronics |
- |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Parts packaging code |
QFN |
- |
QFN |
QFN |
QFN |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
Contacts |
16 |
- |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
Other features |
CAN ALSO OPERATES AT 12 V AND +/-15 V SUPPLY |
- |
CAN ALSO OPERATES AT 12 V AND +/-15 V SUPPLY |
CAN ALSO OPERATES AT 12 V AND +/-15 V SUPPLY |
CAN ALSO OPERATES AT 12 V AND +/-15 V SUPPLY |
CAN ALSO OPERATES AT 12 V AND +/-15 V SUPPLY |
CAN ALSO OPERATES AT 12 V AND +/-15 V SUPPLY |
CAN ALSO OPERATES AT 12 V AND +/-15 V SUPPLY |
CAN ALSO OPERATES AT 12 V AND +/-15 V SUPPLY |
Analog Integrated Circuits - Other Types |
SPST |
- |
SPST |
SPST |
SPST |
SPST |
SPST |
SPST |
SPST |
JESD-30 code |
S-XQCC-N16 |
- |
S-XQCC-N16 |
S-XQCC-N16 |
S-XQCC-N16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
JESD-609 code |
e3 |
- |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
Humidity sensitivity level |
3 |
- |
3 |
3 |
3 |
1 |
1 |
1 |
1 |
Maximum negative supply voltage (Vsup) |
-16.5 V |
- |
-16.5 V |
-16.5 V |
-16.5 V |
-16.5 V |
-16.5 V |
-16.5 V |
-16.5 V |
Negative supply voltage minimum (Vsup) |
-4.5 V |
- |
-4.5 V |
-4.5 V |
-4.5 V |
-4.5 V |
-4.5 V |
-4.5 V |
-4.5 V |
Nominal Negative Supply Voltage (Vsup) |
-5 V |
- |
-5 V |
-5 V |
-5 V |
-5 V |
-5 V |
-5 V |
-5 V |
Number of channels |
1 |
- |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of functions |
4 |
- |
4 |
4 |
4 |
4 |
4 |
4 |
4 |
Nominal off-state isolation |
80 dB |
- |
80 dB |
80 dB |
80 dB |
80 dB |
80 dB |
80 dB |
80 dB |
On-state resistance matching specifications |
0.13 Ω |
- |
0.13 Ω |
0.13 Ω |
0.13 Ω |
0.13 Ω |
0.13 Ω |
0.13 Ω |
0.13 Ω |
Maximum on-state resistance (Ron) |
5.4 Ω |
- |
5.4 Ω |
5.4 Ω |
5.4 Ω |
5.4 Ω |
5.4 Ω |
5.4 Ω |
5.4 Ω |
Package body material |
UNSPECIFIED |
- |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVQCCN |
- |
HVQCCN |
HVQCCN |
HVQCCN |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
Package shape |
SQUARE |
- |
SQUARE |
SQUARE |
SQUARE |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Peak Reflow Temperature (Celsius) |
260 |
- |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
Maximum seat height |
1 mm |
- |
1 mm |
1 mm |
1 mm |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
Maximum supply voltage (Vsup) |
16.5 V |
- |
16.5 V |
16.5 V |
16.5 V |
16.5 V |
16.5 V |
16.5 V |
16.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
- |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
- |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
- |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
Maximum disconnect time |
380 ns |
- |
380 ns |
380 ns |
380 ns |
380 ns |
380 ns |
380 ns |
380 ns |
Maximum connection time |
510 ns |
- |
510 ns |
510 ns |
510 ns |
510 ns |
510 ns |
510 ns |
510 ns |
technology |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
- |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
MATTE TIN |
- |
MATTE TIN |
MATTE TIN |
MATTE TIN |
MATTE TIN |
MATTE TIN |
MATTE TIN |
MATTE TIN |
Terminal form |
NO LEAD |
- |
NO LEAD |
NO LEAD |
NO LEAD |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
- |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
Terminal location |
QUAD |
- |
QUAD |
QUAD |
QUAD |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
- |
40 |
40 |
40 |
40 |
NOT SPECIFIED |
40 |
40 |