RSB6SP35140317

　　 1. Characteristics of Ethernet physical layer signals 　　Ethernet corresponds to the data link layer and physical layer of the OSI seven-layer model. The part corresponding to the data link layer...[Details]

       The problem with IO port simulation of SPI is actually a timing problem, the timing of reading and writing a byte.        First, select 4 IO ports for simulation, namely CS, SCLK, SI, and SO, ...[Details]

Since the tube-flavored tuning circuit designed by the author was launched, it has been favored by many DIY audiophiles. Audiophiles who use this circuit all say that the sound quality of their aud...[Details]

For decades, the automotive industry has strived to personalize the listening experience for each passenger. However, the varying acoustic properties of a vehicle cabin make such personalized sound z...[Details]

　　The interface circuit of the DS1302 device on the enhanced PIC experiment board needs to combine software and hardware to consider how to program. The hardware schematic diagram of the experiment i...[Details]

This article introduces the main features of the dsPIC33FJ series, block diagram and CPU core block diagram, DSP engine block diagram, digital PFC block diagram and various application block diagra...[Details]

The NOP instruction can be seen in many programs in the microcontroller. Some people wonder what this empty instruction is used for. After many experiments, I finally confirmed that (who threw the to...[Details]

Photoelectric switches are non-contact measurement sensors with a wide detection range. They are widely used in many measurement and control systems such as counting, distance measurement, and stro...[Details]

There are two program areas in the STC microcontroller, the user program area and the ISP program area. After the microcontroller is powered on (cold start, not external manual reset or watchdog re...[Details]

SerDes supplier Credo Semiconductor has appointed former Cadence CEO Lip-Bu Tan as its new chairman of the board. Credo develops chips for 100G, 200G, 400G and 800G networks. Tan remains Cadence’s ex...[Details]

Huilun Crystal said in an institutional survey that the company's photolithography process has advantages in the output rate of high-frequency chip production and the accuracy of photolithography ele...[Details]

Recently, Gasgoo Automotive Research Institute released a list of smart cockpit configuration data from January to April 2024, showing the fierce competition among various cockpit configuration sup...[Details]

TSMC's 5nm order momentum is strong, and it is accelerating its pace of capacity expansion. Not only will the new production capacity of the third phase of the Nantai Fab 18 plant (P3) be in place in...[Details]

#include INTRINS.H #include stdio.h #include reg51.h sbit SCK=0x91;//clock line port sbit SDA=0x90;//data line port #define I2C_Address 0xa0 //I2C chip address #define nop _n...[Details]

Whether it is MOSFET, IGBT, SiC MOSFET, or GaN HEMT, each power device requires a corresponding gate driver IC. A suitable driver IC can simplify the complexity of your system design and save R&D t...[Details]