Buffer, CMOS,
Parameter Name | Attribute value |
Maker | RCA |
package instruction | , DIE OR CHIP |
Reach Compliance Code | unknown |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | BUFFER |
MaximumI(ol) | 0.004 A |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Encapsulate equivalent code | DIE OR CHIP |
power supply | 2/6 V |
Prop。Delay @ Nom-Sup | 21 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
CD74HC4050H | CD74HC4049H | CD54HC4050H | CD54HC4050F | CD74HC4049E | CD74HC4050M | CD54HC4049H | CD74HC4050E | CD54HC4049F | CD74HC4049M | |
---|---|---|---|---|---|---|---|---|---|---|
Description | Buffer, CMOS, | Inverter, CMOS, | Buffer, CMOS, | Buffer, CMOS, CDIP16, | Inverter, CMOS, PDIP16, | Buffer, CMOS, PDSO16, | Inverter, CMOS, | Buffer, CMOS, PDIP16, | Inverter, CMOS, CDIP16, | Inverter, CMOS, PDSO16, |
package instruction | , DIE OR CHIP | , DIE OR CHIP | , DIE OR CHIP | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | , DIE OR CHIP | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | BUFFER | INVERTER | BUFFER | BUFFER | INVERTER | BUFFER | INVERTER | BUFFER | INVERTER | INVERTER |
MaximumI(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
Maximum operating temperature | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C | 85 °C | 125 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C | -40 °C | -55 °C | -40 °C |
Encapsulate equivalent code | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP | DIP16,.3 | DIP16,.3 | SOP16,.25 | DIE OR CHIP | DIP16,.3 | DIP16,.3 | SOP16,.25 |
power supply | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
Prop。Delay @ Nom-Sup | 21 ns | 21 ns | 26 ns | 26 ns | 21 ns | 21 ns | 26 ns | 21 ns | 26 ns | 21 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Schmitt trigger | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL |
Maker | RCA | RCA | RCA | RCA | RCA | - | - | RCA | RCA | RCA |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
Is it Rohs certified? | - | - | - | incompatible | incompatible | incompatible | - | incompatible | incompatible | incompatible |
JESD-30 code | - | - | - | R-XDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | - | R-PDIP-T16 | R-XDIP-T16 | R-PDSO-G16 |
JESD-609 code | - | - | - | e0 | e0 | e0 | - | e0 | e0 | e0 |
Number of terminals | - | - | - | 16 | 16 | 16 | - | 16 | 16 | 16 |
Package body material | - | - | - | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
encapsulated code | - | - | - | DIP | DIP | SOP | - | DIP | DIP | SOP |
Package shape | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | - | - | - | IN-LINE | IN-LINE | SMALL OUTLINE | - | IN-LINE | IN-LINE | SMALL OUTLINE |
surface mount | - | - | - | NO | NO | YES | - | NO | NO | YES |
Terminal surface | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | - | - | - | THROUGH-HOLE | THROUGH-HOLE | GULL WING | - | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
Terminal pitch | - | - | - | 2.54 mm | 2.54 mm | 1.27 mm | - | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | - | - | - | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL |