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MC74HC4352DW

Description
4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20, SOIC-20
CategoryAnalog mixed-signal IC    The signal circuit   
File Size451KB,12 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MC74HC4352DW Overview

4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20, SOIC-20

MC74HC4352DW Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeSOIC
package instructionSOP, SOP20,.4
Contacts20
Reach Compliance Codeunknown
Analog Integrated Circuits - Other TypesDIFFERENTIAL MULTIPLEXER
JESD-30 codeR-PDSO-G20
JESD-609 codee0
length12.8 mm
Nominal Negative Supply Voltage (Vsup)-6 V
Number of channels4
Number of functions1
Number of terminals20
Nominal off-state isolation40 dB
Maximum on-state resistance (Ron)140 Ω
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP20,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply2/12 V
Certification statusNot Qualified
Maximum seat height2.65 mm
Maximum supply current (Isup)0.16 mA
Nominal supply voltage (Vsup)6 V
surface mountYES
Maximum disconnect time15 ns
Maximum connection time15 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width7.5 mm

MC74HC4352DW Related Products

MC74HC4352DW MC54HC4352J MC74HC4352N MC74HC4352DWR2
Description 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20, SOIC-20 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP20, CERAMIC, DIP-20 Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDIP20, PLASTIC, DIP-20 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20, SOIC-20
package instruction SOP, SOP20,.4 DIP, DIP, DIP20,.3 SOP, SOP20,.4
Reach Compliance Code unknown unknown unknown unknown
Analog Integrated Circuits - Other Types DIFFERENTIAL MULTIPLEXER DIFFERENTIAL MULTIPLEXER DIFFERENTIAL MULTIPLEXER DIFFERENTIAL MULTIPLEXER
JESD-30 code R-PDSO-G20 R-CDIP-T20 R-PDIP-T20 R-PDSO-G20
JESD-609 code e0 e0 e0 e0
length 12.8 mm 24.515 mm 26.415 mm 12.8 mm
Nominal Negative Supply Voltage (Vsup) -6 V -6 V -6 V -6 V
Number of channels 4 4 4 4
Number of functions 1 1 1 1
Number of terminals 20 20 20 20
Nominal off-state isolation 40 dB 40 dB 40 dB 40 dB
Maximum on-state resistance (Ron) 140 Ω 140 Ω 140 Ω 140 Ω
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
Package body material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP DIP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.65 mm 5.08 mm 4.57 mm 2.65 mm
Maximum supply current (Isup) 0.16 mA 0.16 mA 0.16 mA 0.16 mA
Nominal supply voltage (Vsup) 6 V 6 V 6 V 6 V
surface mount YES NO NO YES
Maximum disconnect time 15 ns 15 ns 15 ns 15 ns
Maximum connection time 15 ns 15 ns 15 ns 15 ns
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
width 7.5 mm 7.62 mm 7.62 mm 7.5 mm
Parts packaging code SOIC DIP - SOIC
Contacts 20 20 - 20
Encapsulate equivalent code SOP20,.4 - DIP20,.3 SOP20,.4
power supply 2/12 V - 2/12 V 2/12 V
switch BREAK-BEFORE-MAKE - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Base Number Matches - 1 1 1

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