MQ80960MC-16 datasheet, PDF - EEWORLD Datasheet

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MQ80960MC-16: DescriptionRISC Microprocessor, 32-Bit, 16MHz, CMOS, CQFP164, CERAMIC, QFP-164; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，38 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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MQ80960MC-16 Overview

RISC Microprocessor, 32-Bit, 16MHz, CMOS, CQFP164, CERAMIC, QFP-164

MQ80960MC-16 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Intel
Parts packaging code	QFP
package instruction	GQFF, QFL164,1.2SQ,25
Contacts	164
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Address bus width	32
bit size	32
boundary scan	NO
maximum clock frequency	32 MHz
External data bus width	32
Format	FLOATING POINT
Integrated cache	NO
JESD-30 code	S-CQFP-F164
JESD-609 code	e0
length	28.702 mm
low power mode	NO
Number of DMA channels
Number of external interrupt devices	4
Number of serial I/Os
Number of terminals	164
On-chip data RAM width
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	GQFF
Encapsulate equivalent code	QFL164,1.2SQ,25
Package shape	SQUARE
Package form	FLATPACK, GUARD RING
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (number of words)	0
Filter level	38535Q/M;38534H;883B
Maximum seat height	2.92 mm
speed	16 MHz
Maximum slew rate	375 mA
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	0.635 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	28.702 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

MQ80960MC-16 Related Products

	MQ80960MC-16	MQ80960MC-20	5962-9094603MXA	MQ80960MC-25	MG80960MC-25	5962-9094603MXX	MG80960MC-20	MG80960MC-16
Description	RISC Microprocessor, 32-Bit, 16MHz, CMOS, CQFP164, CERAMIC, QFP-164	RISC Microprocessor, 32-Bit, 20MHz, CMOS, CQFP164, CERAMIC, QFP-164	RISC Microprocessor, 16-Bit, 25MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132	RISC Microprocessor, 32-Bit, 25MHz, CMOS, CQFP164, CERAMIC, QFP-164	RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132	Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, 1.480 X 1.480 INCH, 0.345 INCH HEIGHT, PGA-132	RISC Microprocessor, 32-Bit, 20MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132	RISC Microprocessor, 32-Bit, 16MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132
Parts packaging code	QFP	QFP	PGA	QFP	PGA	PGA	PGA	PGA
package instruction	GQFF, QFL164,1.2SQ,25	GQFF, QFL164,1.2SQ,25	PGA, PGA132,14X14	GQFF, QFL164,1.2SQ,25	PGA, PGA132,14X14	PGA,	PGA, PGA132,14X14	PGA, PGA132,14X14
Contacts	164	164	132	164	132	132	132	132
Reach Compliance Code	compliant	compliant	unknown	compliant	compliant	unknown	compliant	compliant
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Address bus width	32	32	32	32	32	32	32	32
bit size	32	32	16	32	32	32	32	32
maximum clock frequency	32 MHz	40 MHz	50 MHz	50 MHz	50 MHz	25 MHz	40 MHz	32 MHz
External data bus width	32	32	32	32	32	32	32	32
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
JESD-30 code	S-CQFP-F164	S-CQFP-F164	S-CPGA-P132	S-CQFP-F164	S-CPGA-P132	S-CPGA-P132	S-CPGA-P132	S-CPGA-P132
Number of terminals	164	164	132	164	132	132	132	132
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	GQFF	GQFF	PGA	GQFF	PGA	PGA	PGA	PGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, GUARD RING	FLATPACK, GUARD RING	GRID ARRAY	FLATPACK, GUARD RING	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	MIL-STD-883	38535Q/M;38534H;883B	38535Q/M;38534H;883B	MIL-STD-883	38535Q/M;38534H;883B	38535Q/M;38534H;883B
speed	16 MHz	20 MHz	25 MHz	25 MHz	25 MHz	25 MHz	20 MHz	16 MHz
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	FLAT	PIN/PEG	FLAT	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal location	QUAD	QUAD	PERPENDICULAR	QUAD	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible	-	incompatible	incompatible
Maker	Intel	Intel	-	Intel	Intel	-	Intel	Intel
boundary scan	NO	NO	NO	NO	NO	-	NO	NO
Integrated cache	NO	NO	NO	NO	NO	-	NO	NO
JESD-609 code	e0	e0	e0	e0	e0	-	e0	e0
length	28.702 mm	28.702 mm	36.802 mm	28.702 mm	36.802 mm	-	36.802 mm	36.802 mm
low power mode	NO	NO	NO	NO	NO	-	NO	NO
Number of external interrupt devices	4	4	4	4	4	-	4	4
Encapsulate equivalent code	QFL164,1.2SQ,25	QFL164,1.2SQ,25	PGA132,14X14	QFL164,1.2SQ,25	PGA132,14X14	-	PGA132,14X14	PGA132,14X14
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	-	5 V	5 V
Maximum seat height	2.92 mm	2.92 mm	4.061 mm	2.92 mm	4.061 mm	-	4.061 mm	4.061 mm
Maximum slew rate	375 mA	420 mA	480 mA	480 mA	480 mA	-	420 mA	375 mA
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	TIN LEAD	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal pitch	0.635 mm	0.635 mm	2.54 mm	0.635 mm	2.54 mm	-	2.54 mm	2.54 mm
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	28.702 mm	28.702 mm	36.802 mm	28.702 mm	36.802 mm	-	36.802 mm	36.802 mm
Base Number Matches	-	1	1	1	1	1	1	-

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