RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Intel |
Parts packaging code | PGA |
package instruction | PGA, PGA132,14X14 |
Contacts | 132 |
Reach Compliance Code | compliant |
ECCN code | 3A001.A.2.C |
Address bus width | 32 |
bit size | 32 |
boundary scan | NO |
maximum clock frequency | 50 MHz |
External data bus width | 32 |
Format | FLOATING POINT |
Integrated cache | NO |
JESD-30 code | S-CPGA-P132 |
JESD-609 code | e0 |
length | 36.802 mm |
low power mode | NO |
Number of DMA channels | |
Number of external interrupt devices | 4 |
Number of serial I/Os | |
Number of terminals | 132 |
On-chip data RAM width | |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA |
Encapsulate equivalent code | PGA132,14X14 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
RAM (number of words) | 0 |
Filter level | 38535Q/M;38534H;883B |
Maximum seat height | 4.061 mm |
speed | 25 MHz |
Maximum slew rate | 480 mA |
Maximum supply voltage | 5.25 V |
Minimum supply voltage | 4.75 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 36.802 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
Base Number Matches | 1 |
MG80960MC-25 | MQ80960MC-20 | 5962-9094603MXA | MQ80960MC-25 | 5962-9094603MXX | MG80960MC-20 | MG80960MC-16 | MQ80960MC-16 | |
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Description | RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132 | RISC Microprocessor, 32-Bit, 20MHz, CMOS, CQFP164, CERAMIC, QFP-164 | RISC Microprocessor, 16-Bit, 25MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132 | RISC Microprocessor, 32-Bit, 25MHz, CMOS, CQFP164, CERAMIC, QFP-164 | Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, 1.480 X 1.480 INCH, 0.345 INCH HEIGHT, PGA-132 | RISC Microprocessor, 32-Bit, 20MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132 | RISC Microprocessor, 32-Bit, 16MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132 | RISC Microprocessor, 32-Bit, 16MHz, CMOS, CQFP164, CERAMIC, QFP-164 |
Parts packaging code | PGA | QFP | PGA | QFP | PGA | PGA | PGA | QFP |
package instruction | PGA, PGA132,14X14 | GQFF, QFL164,1.2SQ,25 | PGA, PGA132,14X14 | GQFF, QFL164,1.2SQ,25 | PGA, | PGA, PGA132,14X14 | PGA, PGA132,14X14 | GQFF, QFL164,1.2SQ,25 |
Contacts | 132 | 164 | 132 | 164 | 132 | 132 | 132 | 164 |
Reach Compliance Code | compliant | compliant | unknown | compliant | unknown | compliant | compliant | compliant |
ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
Address bus width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
bit size | 32 | 32 | 16 | 32 | 32 | 32 | 32 | 32 |
maximum clock frequency | 50 MHz | 40 MHz | 50 MHz | 50 MHz | 25 MHz | 40 MHz | 32 MHz | 32 MHz |
External data bus width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Format | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
JESD-30 code | S-CPGA-P132 | S-CQFP-F164 | S-CPGA-P132 | S-CQFP-F164 | S-CPGA-P132 | S-CPGA-P132 | S-CPGA-P132 | S-CQFP-F164 |
Number of terminals | 132 | 164 | 132 | 164 | 132 | 132 | 132 | 164 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA | GQFF | PGA | GQFF | PGA | PGA | PGA | GQFF |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY | FLATPACK, GUARD RING | GRID ARRAY | FLATPACK, GUARD RING | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK, GUARD RING |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 | 38535Q/M;38534H;883B | MIL-STD-883 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
speed | 25 MHz | 20 MHz | 25 MHz | 25 MHz | 25 MHz | 20 MHz | 16 MHz | 16 MHz |
Maximum supply voltage | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
Minimum supply voltage | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | NO | YES | NO | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal form | PIN/PEG | FLAT | PIN/PEG | FLAT | PIN/PEG | PIN/PEG | PIN/PEG | FLAT |
Terminal location | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | QUAD |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
Is it Rohs certified? | incompatible | incompatible | - | incompatible | - | incompatible | incompatible | incompatible |
Maker | Intel | Intel | - | Intel | - | Intel | Intel | Intel |
boundary scan | NO | NO | NO | NO | - | NO | NO | NO |
Integrated cache | NO | NO | NO | NO | - | NO | NO | NO |
JESD-609 code | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 |
length | 36.802 mm | 28.702 mm | 36.802 mm | 28.702 mm | - | 36.802 mm | 36.802 mm | 28.702 mm |
low power mode | NO | NO | NO | NO | - | NO | NO | NO |
Number of external interrupt devices | 4 | 4 | 4 | 4 | - | 4 | 4 | 4 |
Encapsulate equivalent code | PGA132,14X14 | QFL164,1.2SQ,25 | PGA132,14X14 | QFL164,1.2SQ,25 | - | PGA132,14X14 | PGA132,14X14 | QFL164,1.2SQ,25 |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V |
Maximum seat height | 4.061 mm | 2.92 mm | 4.061 mm | 2.92 mm | - | 4.061 mm | 4.061 mm | 2.92 mm |
Maximum slew rate | 480 mA | 420 mA | 480 mA | 480 mA | - | 420 mA | 375 mA | 375 mA |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal pitch | 2.54 mm | 0.635 mm | 2.54 mm | 0.635 mm | - | 2.54 mm | 2.54 mm | 0.635 mm |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 36.802 mm | 28.702 mm | 36.802 mm | 28.702 mm | - | 36.802 mm | 36.802 mm | 28.702 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |