RTX2000GM-8/883
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Renesas Electronics Corporation |
Reach Compliance Code | not_compliant |
bit size | 16 |
JESD-30 code | S-XPGA-P84 |
JESD-609 code | e0 |
Number of terminals | 84 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | PGA |
Encapsulate equivalent code | PGA84M,11X11 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Certification status | Not Qualified |
RAM (bytes) | |
rom(word) | 0 |
ROM programmability | N/A |
Filter level | 38535Q/M;38534H;883B |
speed | 8 MHz |
Maximum slew rate | 80.5 mA |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
RTX2000GM-8/883 | RTX2000GI-10 | RTX2000GI-8 | RTX2000JI-10 | RTX2000JI-8 | |
---|---|---|---|---|---|
Description | RTX2000GM-8/883 | RTX2000GI-10 | RTX2000GI-8 | RTX2000JI-10 | RTX2000JI-8 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
bit size | 16 | 16 | 16 | 16 | 16 |
JESD-30 code | S-XPGA-P84 | S-XPGA-P84 | S-XPGA-P84 | S-PQCC-J84 | S-PQCC-J84 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
Number of terminals | 84 | 84 | 84 | 84 | 84 |
Maximum operating temperature | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | PGA | PGA | PGA | QCCJ | QCCJ |
Encapsulate equivalent code | PGA84M,11X11 | PGA84M,11X11 | PGA84M,11X11 | LDCC84,1.2SQ | LDCC84,1.2SQ |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | CHIP CARRIER | CHIP CARRIER |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM programmability | N/A | N/A | N/A | N/A | N/A |
speed | 8 MHz | 10 MHz | 8 MHz | 10 MHz | 8 MHz |
Maximum slew rate | 80.5 mA | 100.5 mA | 80.5 mA | 100.5 mA | 80.5 mA |
surface mount | NO | NO | NO | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | J BEND | J BEND |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
Terminal location | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD |