HN62444BNCP-12 datasheet, PDF - EEWORLD Datasheet

HN62444BNCP-12: DescriptionMASK ROM, 256KX16, 120ns, CMOS, PQCC44, PLASTIC, LCC-44; Categorystorage storage; File Size106KB，6 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HN62444BNCP-12 Overview

MASK ROM, 256KX16, 120ns, CMOS, PQCC44, PLASTIC, LCC-44

Parameter Name	Attribute value
Maker	Hitachi （Renesas ）
Parts packaging code	LCC
package instruction	QCCJ,
Contacts	44
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	120 ns
JESD-30 code	S-PQCC-J44
length	16.5862 mm
memory density	4194304 bit
Memory IC Type	MASK ROM
memory width	16
Number of functions	1
Number of terminals	44
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX16
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.6 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	16.5862 mm

	HN62444BNCP-12	HN62444BNP-12
Description	MASK ROM, 256KX16, 120ns, CMOS, PQCC44, PLASTIC, LCC-44	MASK ROM, 256KX16, 120ns, CMOS, PDIP40, PLASTIC, DIP-40
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	LCC	DIP
package instruction	QCCJ,	DIP,
Contacts	44	40
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Maximum access time	120 ns	120 ns
JESD-30 code	S-PQCC-J44	R-PDIP-T40
length	16.5862 mm	52.8 mm
memory density	4194304 bit	4194304 bit
Memory IC Type	MASK ROM	MASK ROM
memory width	16	16
Number of functions	1	1
Number of terminals	44	40
word count	262144 words	262144 words
character code	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	256KX16	256KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	DIP
Package shape	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified
Maximum seat height	4.6 mm	5.08 mm
Maximum supply voltage (Vsup)	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	J BEND	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm
Terminal location	QUAD	DUAL
width	16.5862 mm	15.24 mm

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

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