|
FQD2N60C |
FQU2N60C |
Description |
Power Field-Effect Transistor, 1.9A I(D), 600V, 4.7ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252 |
Power Field-Effect Transistor, 1.9A I(D), 600V, 4.7ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET |
Is it Rohs certified? |
conform to |
conform to |
Maker |
ON Semiconductor |
ON Semiconductor |
package instruction |
ROHS COMPLIANT, DPAK-3 |
IN-LINE, R-PSIP-T3 |
Reach Compliance Code |
not_compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
Avalanche Energy Efficiency Rating (Eas) |
120 mJ |
120 mJ |
Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage |
600 V |
600 V |
Maximum drain current (ID) |
1.9 A |
1.9 A |
Maximum drain-source on-resistance |
4.7 Ω |
4.7 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
JESD-30 code |
R-PSSO-G2 |
R-PSIP-T3 |
Number of components |
1 |
1 |
Number of terminals |
2 |
3 |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
Maximum operating temperature |
150 °C |
150 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
IN-LINE |
Peak Reflow Temperature (Celsius) |
260 |
NOT SPECIFIED |
Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
Maximum pulsed drain current (IDM) |
7.6 A |
7.6 A |
Certification status |
Not Qualified |
Not Qualified |
surface mount |
YES |
NO |
Terminal form |
GULL WING |
THROUGH-HOLE |
Terminal location |
SINGLE |
SINGLE |
Maximum time at peak reflow temperature |
30 |
NOT SPECIFIED |
transistor applications |
SWITCHING |
SWITCHING |
Transistor component materials |
SILICON |
SILICON |