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GS832136AGD-375IT

Description
Cache SRAM, 1MX36, 4.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165
Categorystorage    storage   
File Size489KB,32 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance
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GS832136AGD-375IT Overview

Cache SRAM, 1MX36, 4.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165

GS832136AGD-375IT Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeBGA
package instructionLBGA, BGA165,11X15,40
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time4.5 ns
Other featuresPIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY
Maximum clock frequency (fCLK)375 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B165
length15 mm
memory density37748736 bit
Memory IC TypeCACHE SRAM
memory width36
Number of functions1
Number of terminals165
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA165,11X15,40
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5/3.3 V
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum standby current0.04 A
Minimum standby current2.3 V
Maximum slew rate0.35 mA
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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