OTP ROM, 1KX4, 10ns, ECL, CDIP20, HERMETIC SEALED, CERAMIC, DIP-20
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | AMD |
Parts packaging code | DIP |
package instruction | DIP, DIP20,.3 |
Contacts | 20 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 10 ns |
JESD-30 code | R-GDIP-T20 |
length | 24.257 mm |
memory density | 4096 bit |
Memory IC Type | OTP ROM |
memory width | 4 |
Negative supply voltage rating | -5.2 V |
Number of functions | 1 |
Number of terminals | 20 |
word count | 1024 words |
character code | 1000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 75 °C |
Minimum operating temperature | |
organize | 1KX4 |
Output characteristics | OPEN-EMITTER |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | -5 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
surface mount | NO |
technology | ECL |
Temperature level | COMMERCIAL EXTENDED |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |