Small Signal Bipolar Transistor, 15V V(BR)CEO, 1-Element, NPN, Silicon, SURFACE MOUNT PACKAGE-4
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | SMALL OUTLINE, R-XDSO-N4 |
Contacts | 4 |
Reach Compliance Code | compli |
Collector-emitter maximum voltage | 15 V |
Configuration | SINGLE |
Minimum DC current gain (hFE) | 20 |
JESD-30 code | R-XDSO-N4 |
JESD-609 code | e0 |
Number of components | 1 |
Number of terminals | 4 |
Maximum operating temperature | 200 °C |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | NPN |
Certification status | Not Qualified |
Guideline | MIL-19500/317K |
surface mount | YES |
Terminal surface | TIN LEAD |
Terminal form | NO LEAD |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
Maximum off time (toff) | 18 ns |
Maximum opening time (tons) | 12 ns |
Base Number Matches | 1 |
JANTXV2N4449UA | JANTX2N4449UA | JANTX2N4449UB | JANTXV2N4449UB | JANTX2N4449U | JANTXV2N4449U | JANTX2N2369AUA | JANTXV2N2369AU | |
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Description | Small Signal Bipolar Transistor, 15V V(BR)CEO, 1-Element, NPN, Silicon, SURFACE MOUNT PACKAGE-4 | Small Signal Bipolar Transistor, 15V V(BR)CEO, 1-Element, NPN, Silicon, SURFACE MOUNT PACKAGE-4 | Small Signal Bipolar Transistor, 20V V(BR)CEO, 1-Element, NPN, Silicon, CERAMIC PACKAGE-3 | Small Signal Bipolar Transistor, 20V V(BR)CEO, 1-Element, NPN, Silicon, CERAMIC PACKAGE-3 | Small Signal Bipolar Transistor, 15V V(BR)CEO, 1-Element, NPN, Silicon, SURFACE MOUNT PACKAGE-6 | Small Signal Bipolar Transistor, 15V V(BR)CEO, 1-Element, NPN, Silicon, SURFACE MOUNT PACKAGE-6 | Small Signal Bipolar Transistor, 15V V(BR)CEO, 1-Element, NPN, Silicon, SURFACE MOUNT PACKAGE-4 | Small Signal Bipolar Transistor, 15V V(BR)CEO, 2-Element, NPN, Silicon, SURFACE MOUNT PACKAGE-6 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | SMALL OUTLINE, R-XDSO-N4 | SMALL OUTLINE, R-XDSO-N4 | SMALL OUTLINE, R-CDSO-N3 | SMALL OUTLINE, R-CDSO-N3 | SMALL OUTLINE, R-XDSO-N6 | SMALL OUTLINE, R-CDSO-N6 | SURFACE MOUNT PACKAGE-4 | SMALL OUTLINE, R-XDSO-N6 |
Contacts | 4 | 4 | 3 | 3 | 6 | 6 | 4 | 6 |
Reach Compliance Code | compli | unknown | compli | compli | unknow | unknow | unknown | not_compliant |
Collector-emitter maximum voltage | 15 V | 15 V | 20 V | 20 V | 15 V | 15 V | 15 V | 15 V |
Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SEPARATE, 2 ELEMENTS | SINGLE | SINGLE | SEPARATE, 2 ELEMENTS |
Minimum DC current gain (hFE) | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
JESD-30 code | R-XDSO-N4 | R-XDSO-N4 | R-CDSO-N3 | R-CDSO-N3 | R-XDSO-N6 | R-CDSO-N6 | R-XDSO-N4 | R-XDSO-N6 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Number of components | 1 | 1 | 1 | 1 | 2 | 1 | 1 | 2 |
Number of terminals | 4 | 4 | 3 | 3 | 6 | 6 | 4 | 6 |
Maximum operating temperature | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C |
Package body material | UNSPECIFIED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Polarity/channel type | NPN | NPN | NPN | NPN | NPN | NPN | NPN | NPN |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Qualified |
Guideline | MIL-19500/317K | MIL-19500/317K | MIL-19500/317K | MIL-19500/317K | MIL-19500/317K | MIL-19500/317 | MIL-19500 | MIL-19500 |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
transistor applications | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
Transistor component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
Maximum off time (toff) | 18 ns | 18 ns | 18 ns | 18 ns | 18 ns | 18 ns | 18 ns | 18 ns |
Maximum opening time (tons) | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | - | - |