D/A Converter, 2 Func, Parallel, 8 Bits Input Loading, PDIP20, 0.300 INCH, PLASTIC, DIP-20
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Maxim |
Parts packaging code | DIP |
package instruction | DIP, DIP20,.3 |
Contacts | 20 |
Reach Compliance Code | not_compliant |
Factory Lead Time | 1 week |
Converter type | D/A CONVERTER |
Enter bit code | BINARY |
Input format | PARALLEL, 8 BITS |
JESD-30 code | R-PDIP-T20 |
JESD-609 code | e0 |
length | 26.16 mm |
Maximum linear error (EL) | 0.1953% |
Humidity sensitivity level | 1 |
Number of digits | 8 |
Number of functions | 2 |
Number of terminals | 20 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | 245 |
power supply | 5/15 V |
Certification status | Not Qualified |
Maximum seat height | 4.572 mm |
Maximum stabilization time | 0.4 µs |
Maximum slew rate | 1 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
MX7528KEPP | MX7528KCWP | MX7528KN | MX7528LCWP | MX7528LEWP | MX7528UQ | MX7528CQ | |
---|---|---|---|---|---|---|---|
Description | D/A Converter, 2 Func, Parallel, 8 Bits Input Loading, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | D/A Converter, 2 Func, Parallel, 8 Bits Input Loading, PDSO20, 0.300 INCH, SOIC-20 | D/A Converter, 2 Func, Parallel, 8 Bits Input Loading, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | D/A Converter, 2 Func, Parallel, 8 Bits Input Loading, PDSO20, 0.300 INCH, SOIC-20 | D/A Converter, 2 Func, Parallel, 8 Bits Input Loading, PDSO20, 0.300 INCH, SOIC-20 | D/A Converter, 2 Func, Parallel, 8 Bits Input Loading, CDIP20, 0.300 INCH, CERAMIC, DIP-20 | D/A Converter, 2 Func, Parallel, 8 Bits Input Loading, CDIP20, 0.300 INCH, CERAMIC, DIP-20 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Maxim | Maxim | Maxim | Maxim | Maxim | Maxim | Maxim |
Parts packaging code | DIP | SOIC | DIP | SOIC | SOIC | DIP | DIP |
package instruction | DIP, DIP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 | 0.300 INCH, CERAMIC, DIP-20 | DIP, DIP20,.3 |
Contacts | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
Enter bit code | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
Input format | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
JESD-30 code | R-PDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-GDIP-T20 | R-GDIP-T20 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Maximum linear error (EL) | 0.1953% | 0.1953% | 0.1953% | 0.1953% | 0.1953% | 0.1953% | 0.1953% |
Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of digits | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Maximum operating temperature | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 125 °C | 85 °C |
Minimum operating temperature | -40 °C | - | - | - | -40 °C | -55 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
encapsulated code | DIP | SOP | DIP | SOP | SOP | DIP | DIP |
Encapsulate equivalent code | DIP20,.3 | SOP20,.4 | DIP20,.3 | SOP20,.4 | SOP20,.4 | DIP20,.3 | DIP20,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | 245 | 245 | 245 | 245 | 245 | 245 | 245 |
power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 4.572 mm | 2.65 mm | 4.572 mm | 2.65 mm | 2.65 mm | 5.08 mm | 5.08 mm |
Maximum stabilization time | 0.4 µs | 0.4 µs | - | 0.4 µs | 0.4 µs | 0.4 µs | 0.4 µs |
Maximum slew rate | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | NO | YES | YES | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | MILITARY | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm | 7.62 mm |
length | 26.16 mm | 12.8 mm | 26.16 mm | 12.8 mm | 12.8 mm | - | - |
ECCN code | - | EAR99 | EAR99 | EAR99 | - | 3A001.A.2.C | - |