Fast Page DRAM, 4MX1, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20
Parameter Name | Attribute value |
Maker | Micron Technology |
Parts packaging code | SOJ |
package instruction | SOJ, |
Contacts | 20 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FAST PAGE |
Maximum access time | 80 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 code | R-PDSO-J20 |
length | 17.17 mm |
memory density | 4194304 bit |
Memory IC Type | FAST PAGE DRAM |
memory width | 1 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 20 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX1 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOJ |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Certification status | Not Qualified |
refresh cycle | 1024 |
Maximum seat height | 3.61 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 7.67 mm |
MT4C1004JDJ-8TR | MT4C1004JTG-8S | MT4C1004JTG-8STR | MT4C1004JTG-8 | MT4C1004JDJ-8S | MT4C1004JDJ-8STR | MT4C1004JDJ-8 | |
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Description | Fast Page DRAM, 4MX1, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 4MX1, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 | Fast Page DRAM, 4MX1, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 | Fast Page DRAM, 4MX1, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 | Fast Page DRAM, 4MX1, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 4MX1, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 4MX1, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 |
Maker | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
Parts packaging code | SOJ | TSOP | TSOP | TSOP | SOJ | SOJ | SOJ |
package instruction | SOJ, | 0.300 INCH, PLASTIC, TSOP-26/20 | TSOP2, | 0.300 INCH, PLASTIC, TSOP-26/20 | 0.300 INCH, PLASTIC, SOJ-26/20 | SOJ, | 0.300 INCH, PLASTIC, SOJ-26/20 |
Contacts | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | not_compliant | not_compliant | unknown | not_compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
Maximum access time | 80 ns | 80 ns | 80 ns | 80 ns | 80 ns | 80 ns | 80 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/BATTERY BACKUP/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/BATTERY BACKUP/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/BATTERY BACKUP/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/BATTERY BACKUP/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 code | R-PDSO-J20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-J20 | R-PDSO-J20 | R-PDSO-J20 |
length | 17.17 mm | 17.14 mm | 17.14 mm | 17.14 mm | 17.17 mm | 17.17 mm | 17.17 mm |
memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
Memory IC Type | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
memory width | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
word count | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
character code | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOJ | TSOP2 | TSOP2 | TSOP2 | SOJ | SOJ | SOJ |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
Maximum seat height | 3.61 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.61 mm | 3.61 mm | 3.61 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | J BEND | GULL WING | GULL WING | GULL WING | J BEND | J BEND | J BEND |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
width | 7.67 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.67 mm | 7.67 mm | 7.67 mm |
Is it lead-free? | - | Contains lead | - | Contains lead | Contains lead | - | Contains lead |
Is it Rohs certified? | - | incompatible | - | incompatible | incompatible | - | incompatible |
I/O type | - | SEPARATE | - | SEPARATE | SEPARATE | - | SEPARATE |
JESD-609 code | - | e0 | e0 | e0 | e0 | - | e0 |
Encapsulate equivalent code | - | TSSOP20/26,.36 | - | TSSOP20/26,.36 | SOJ20/26,.34 | - | SOJ20/26,.34 |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | 235 |
power supply | - | 5 V | - | 5 V | 5 V | - | 5 V |
self refresh | - | YES | YES | NO | YES | YES | NO |
Maximum standby current | - | 0.0002 A | - | 0.001 A | 0.0002 A | - | 0.001 A |
Maximum slew rate | - | 0.09 mA | - | 0.09 mA | 0.09 mA | - | 0.09 mA |
Terminal surface | - | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | 30 |