MA4P404-31 datasheet, PDF - EEWORLD Datasheet

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MA4P404-31: DescriptionSILICON, PIN DIODE, HERMETIC SEALED, CERAMIC, CASE 31, 2 PIN; CategoryDiscrete semiconductor diode; File Size365KB，7 Pages; ManufacturerTE Connectivity; Websitehttp://www.te.com

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MA4P404-31 Overview

SILICON, PIN DIODE, HERMETIC SEALED, CERAMIC, CASE 31, 2 PIN

MA4P404-31 Parametric

Parameter Name	Attribute value
Maker	TE Connectivity
package instruction	O-CEMW-N2
Contacts	2
Manufacturer packaging code	CASE 31
Reach Compliance Code	unknown
Other features	HIGH RELIABILITY
application	SWITCHING
Configuration	SINGLE
Maximum diode capacitance	0.4 pF
Diode component materials	SILICON
Maximum diode forward resistance	0.6 Ω
Diode type	PIN DIODE
JESD-30 code	O-CEMW-N2
Minority carrier nominal lifetime	1 µs
Number of components	1
Number of terminals	2
Maximum operating temperature	175 °C
Minimum operating temperature	-65 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	ROUND
Package form	MICROWAVE
Certification status	Not Qualified
Reverse test voltage	250 V
surface mount	YES
technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal form	NO LEAD
Terminal location	END

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Packaged PIN Diodes

RoHS Compliant

Features

♦

High Power

Fast Speed

Voltage Ratings to 1500 Volts

Wide Selection of Carrier Lifetimes

Wide Selection of Capacitances

Assortment of Packages Styles

Available Screened for Military Applications

Rev V.6

Maximum Power Dissipation

diss

30,31,32,36,43,94,111,120,150,255 T (max Operating)-25°C

Thermal Resistance

258,296,1072,1079

Leaded Packages

@+25°C

186, 276,1088

Surface Mount Package

+25°C

1056

diss

= 250mW

Cathode Heatsink Packages

Description and Applications

M/A-COM's broad line of packaged PIN diodes

encompasses a comprehensive range of electrical

characteristics and package outlines. This diverse union

of semiconductor technology and chip packaging gives

considerable flexibility to the circuit designer. The fast

switching series of packaged PIN diodes utilize a thin

I-region and silicon oxide or glass passivated chips

which provide for low leakage currents and low insertion

loss. Using in process control monitors to regulate wafer

fabrication parameters these devices achieve consistent

performance in control circuit applications. The high

voltage product line of packaged PIN diodes employs

M/A-COM's unique CERMACHIP

passivation

process

which provides for a hard glass encapsulation that

hermetically seals the active area of the chip. These

packaged CERMACHIP PIN diodes are ideally suited

for use in high power applications where high RF

voltages are present. The diode chips are bonded into

sealed ceramic packages that are designed for the most

stringent electrical and environmental conditions. A wide

choice of packages are available which can be mounted

into a variety of microwave and RF circuit media. The

Packaged PIN Diodes series are designed to have a

high inherent reliability and may be ordered screened to

meet many MIL-STD reliability levels.

diss

= 300mW

Co-Axial Packages

31,32,94

30, 296

120,255

Surface Mount Packages

276

1088

1056

186

1072,1079

Threaded Packages

Absolute Maximum Ratings

Parameter

Voltage

Operating Temperature

Storage Temperature

Operating and Storage

(Case Style 1088)

Absolution Max.

As Specified in Table

- 65°C to +175°C

- 65°C to +200°C

- 65°C to +125°C

150

111

258

Unpackaged Die

1. Operation beyond any one of the above conditions may

cause permanent damage to the device.

Specifications subject to change without prior notification.

131,132.134 , 212

ADVANCED:

Data Sheets contain information regarding a product M/A-COM is considering for

•

North America

Tel: 800.366.2266 / Fax: 978.366.2266

development. Performance is based on target specifications, simulated results, and/or prototype

•

Europe

Tel: 44.1908.574.200 / Fax: 44.1908.574.300

measurements. Commitment to develop is not guaranteed.

•

Asia/Pacific

Tel: 81.44.844.8296 / Fax: 81.44.844.8298

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM has under develop-

Visit www.macom.com for additional data sheets and product information.

ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has

been fixed. Engineering samples and/or test data may be available. Commitment to produce in

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)) or

volume is not guaranteed.

information contained herein without notice.

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