IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PDSO16, 0.159 INCH, PLASTIC, SOP-16, Cordless Telephone IC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
package instruction | SOP, SOP16,.25 |
Reach Compliance Code | compliant |
JESD-30 code | R-PDSO-G16 |
JESD-609 code | e0 |
length | 9.9 mm |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | -10 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP16,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
power supply | 2.85/3.6 V |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
Maximum slew rate | 0.007 mA |
surface mount | YES |
technology | BICMOS |
Telecom integrated circuit types | CORDLESS TELEPHONE BASEBAND CIRCUIT |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 3.9 mm |
LMX2411MX | LMX2411M | |
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Description | IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PDSO16, 0.159 INCH, PLASTIC, SOP-16, Cordless Telephone IC | IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PDSO16, 0.159 INCH, PLASTIC, SOP-16, Cordless Telephone IC |
Is it Rohs certified? | incompatible | incompatible |
Maker | National Semiconductor(TI ) | National Semiconductor(TI ) |
package instruction | SOP, SOP16,.25 | SOP, SOP16,.25 |
Reach Compliance Code | compliant | compliant |
JESD-30 code | R-PDSO-G16 | R-PDSO-G16 |
JESD-609 code | e0 | e0 |
length | 9.9 mm | 9.9 mm |
Number of functions | 1 | 1 |
Number of terminals | 16 | 16 |
Maximum operating temperature | 70 °C | 70 °C |
Minimum operating temperature | -10 °C | -10 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | SOP |
Encapsulate equivalent code | SOP16,.25 | SOP16,.25 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE |
power supply | 2.85/3.6 V | 2.85/3.6 V |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 1.75 mm | 1.75 mm |
Maximum slew rate | 0.007 mA | 0.007 mA |
surface mount | YES | YES |
technology | BICMOS | BICMOS |
Telecom integrated circuit types | CORDLESS TELEPHONE BASEBAND CIRCUIT | CORDLESS TELEPHONE BASEBAND CIRCUIT |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL |
width | 3.9 mm | 3.9 mm |