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KM23C8100HFP1-15

Description
MASK ROM, 1MX8, 150ns, CMOS, PQFP44, QFP-44
Categorystorage    storage   
File Size94KB,4 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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KM23C8100HFP1-15 Overview

MASK ROM, 1MX8, 150ns, CMOS, PQFP44, QFP-44

KM23C8100HFP1-15 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeQFP
package instructionQFP, QFP44,.7SQ,32
Contacts44
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time150 ns
Spare memory width16
JESD-30 codeS-PQFP-G44
JESD-609 codee0
length14 mm
memory density8388608 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals44
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP44,.7SQ,32
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum standby current0.00005 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm

KM23C8100HFP1-15 Related Products

KM23C8100HFP1-15 KM23C8100HFP1-10 KM23C8100HFP1-12
Description MASK ROM, 1MX8, 150ns, CMOS, PQFP44, QFP-44 MASK ROM, 1MX8, 100ns, CMOS, PQFP44, QFP-44 MASK ROM, 1MX8, 120ns, CMOS, PQFP44, QFP-44
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
Maker SAMSUNG SAMSUNG SAMSUNG
Parts packaging code QFP QFP QFP
package instruction QFP, QFP44,.7SQ,32 QFP, QFP44,.7SQ,32 QFP, QFP44,.7SQ,32
Contacts 44 44 44
Reach Compliance Code compliant compliant compliant
ECCN code EAR99 EAR99 EAR99
Maximum access time 150 ns 100 ns 120 ns
Spare memory width 16 16 16
JESD-30 code S-PQFP-G44 S-PQFP-G44 S-PQFP-G44
JESD-609 code e0 e0 e0
length 14 mm 14 mm 14 mm
memory density 8388608 bit 8388608 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM MASK ROM
memory width 8 8 8
Number of functions 1 1 1
Number of terminals 44 44 44
word count 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 1MX8 1MX8 1MX8
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QFP QFP
Encapsulate equivalent code QFP44,.7SQ,32 QFP44,.7SQ,32 QFP44,.7SQ,32
Package shape SQUARE SQUARE SQUARE
Package form FLATPACK FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum standby current 0.00005 A 0.00005 A 0.00005 A
Maximum slew rate 0.06 mA 0.06 mA 0.06 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.8 mm
Terminal location QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 14 mm 14 mm 14 mm
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