Silicon PIN diode
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | NXP |
Parts packaging code | DFN |
package instruction | 1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SMD, 2 PIN |
Contacts | 2 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
application | ATTENUATOR; SWITCHING |
Minimum breakdown voltage | 30 V |
Configuration | SINGLE |
Maximum diode capacitance | 0.85 pF |
Nominal diode capacitance | 0.37 pF |
Diode component materials | SILICON |
Maximum diode forward resistance | 0.9 Ω |
Diode resistance test current | 5 mA |
Diode resistance test frequency | 100 MHz |
Diode type | PIN DIODE |
JESD-30 code | R-PDSO-N2 |
JESD-609 code | e3 |
Minority carrier nominal lifetime | 0.18 µs |
Humidity sensitivity level | 1 |
Number of components | 1 |
Number of terminals | 2 |
Maximum operating temperature | 150 °C |
Minimum operating temperature | -65 °C |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 |
Maximum power dissipation | 0.135 W |
Certification status | Not Qualified |
Reverse test voltage | 20 V |
surface mount | YES |
technology | POSITIVE-INTRINSIC-NEGATIVE |
Terminal surface | Tin (Sn) |
Terminal form | NO LEAD |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |