Super low On resistance/ Low voltage LDO
R1173x SERIES
OUTLINE
The R1173x Series are CMOS-based positive voltage regulator ICs. The R1173x Series have features of
super low dropout, 1A output current capability, and -3mV typical load regulation at 1A. Even the output voltage
is set at 1.5V, on resistance of internal FET is typically 0.32Ω. Therefore, applications that require a large current
at small dropout are suitable for the R1173x series. Low input voltage is acceptable and low output voltage can
be set. The minimum input voltage is 1.4V, and the lowest set output voltage is 0.8V. Each of these ICs consists
of a voltage reference unit, an error amplifier, resistor net for setting output voltage, a current limit circuit at
over-current, a chip enable circuit, a thermal-shutdown circuit, and so on. A stand-by mode with ultra low
consumption current can be realized with the chip enable pin. The output voltage types of R1173 are fixed one in
the IC and adjustable one (R1173x001x).
Since the packages for these ICs are the SOT-89-5 package, HSON-6, or HSOP-6J, high density mounting of
the ICs on boards is possible.
FEATURES
•
Ultra-Low Supply Current ............................................. Typ. 60µA
•
Good Load Regulation ................................................. Typ. –2mV, Max.
±15mV
at I
OUT
=300mA
.....................................................................................Typ. –3mV at I
OUT
=1000mA
•
Low inrush current at turning-on .................................. Typ. 500mA
•
Minimum Input Voltage................................................. Min. 1.4V
•
Low Standby Current.................................................... Typ. 0.1µA
•
Output Current.............................................................. Max. 1A
•
Output Voltage ............................................Stepwise setting with a step of 0.1V in the range of
0.8V to 5.0V(Fixed output voltage type, except HSOP6J: only 0.8V to 3.5V type is available.) or
adjustable. (R1173X001X)
•
High Power Supply Ripple Rejection .............
Typ. 70dB (V
OUT
=3.0V)
•
High Output Voltage Accuracy......................................
±2.0%
•
Low Dropout Voltage .................................................... Typ. 0.18V (V
OUT
=3.0V,
I
OUT
=1A)
........................... Typ. 0.32V (V
OUT
=1.5V/ I
OUT
=1A)
•
Line Regulation ............................................................ Typ. 0.05%/V
•
Packages...................................................................... SOT-89-5, HSON-6, High power-HSOP-6J
•
Built-in Current Limit Circuit
•
Built-in Thermal Shutdown Circuit
•
Low Temperature-drift Coefficient of Output Voltage ... Typ.
±100ppm/°C
•
Output capacitors ......................................................... C
IN
=C
OUT
=Tantalum 4.7µF(V
OUT
<1.0V)
...................................................................................... C
IN
=C
OUT
=Ceramic 4.7µF(V
OUT
≥1.0V)
APPLICATIONS
•
Local Power source for Notebook PC.
•
Local Power source for portable communication equipments, cameras, and videos.
1
R1173x)
SELECTION GUIDE
The output voltage, with/without auto-discharge function, the package type, etc. can be selected at the
user's request.
The selection can be made with the part number as follows;
R1173x xx1x-xx
↑
a
Code
a
↑ ↑ ↑
b c d
←Part
Number
Contents
Package Type; H: SOT-89-5, D: HSON-6, S: HSOP-6J
Designation of Output Voltage (V
OUT
)
External Setting Type: 00
Fixed Type: 08 to 50 Stepwise setting with 0.1V increment in the range from
0.8V to 5.0V, exceptions; 2.85V output: R1173x281x5-xx, 1.85V output:
R1173x181x5-xx
Designation of option;
B: Built-in Chip Enable Circuit, Active at "H", without auto-discharge
D: Built-in Chip Enable Circuit, Active at "H", with auto-discharge
Designation of Taping Type;
T1 or T2 (SOT-89-5), TR (HSON-6), E2 (HSOP-6J)
(Refer to Taping Specifications)
b
c
d
PIN CONFIGURATION
z
SOT-89-5
5
4
z
HSON-6
6
5
4
z
HSOP-6J
6
5
4
Φ1.0
1
2
3
R
1
2
3
1
2
3
PIN DESCRIPTION
z
SOT-89-5
Pin No
1
2
3
4
5
Symbol
ADJ or NC
GND
CE
V
DD
V
OUT
3
R1173x)
Power Dissipation (HSON-6)
Power dissipation depends on mounting conditions, the data below is an example.
•
Measurement Conditions
•
Mounting on board: Wind velocity=0m/s
•
Board Material: Glass Epoxy Resin (Double Layers)
•
Board Dimensions: 40mm*40mm*1.6mm
•
Wiring Ratio: 50%
•
* Measurement Result:
•
Power Dissipation: 900mW (Topt=25°C, Tjmax=125°C)
•
Thermal Resistance 111°C/W
Power Dissipation (HSON-6)
1000
Power Dissipation Pd(mW)
800
600
400
200
0
0
25
50
75
100
125
150
Temperature Topt (°C)
5
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