Loadable PLD, 0.6ns, CMOS, PBGA356, BGA-356
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Intel |
| package instruction | LBGA, |
| Reach Compliance Code | compliant |
| Other features | 2880 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
| maximum clock frequency | 66.67 MHz |
| JESD-30 code | S-PBGA-B356 |
| JESD-609 code | e1 |
| length | 35 mm |
| Dedicated input times | 4 |
| Number of I/O lines | 274 |
| Number of terminals | 356 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4 DEDICATED INPUTS, 274 I/O |
| Output function | REGISTERED |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LBGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY, LOW PROFILE |
| Peak Reflow Temperature (Celsius) | 245 |
| Programmable logic type | LOADABLE PLD |
| propagation delay | 0.6 ns |
| Certification status | Not Qualified |
| Maximum seat height | 1.63 mm |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 40 |
| width | 35 mm |
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