SSM9918H,J
N-CHANNEL ENHANCEMENT-MODE
POWER MOSFET
Low on-resistance
Capable of 2.5V gate drive
Low drive current
Surface mount package
D
BV
DSS
R
DS(ON)
I
D
20V
14mΩ
45A
G
S
Description
Power MOSFETs from Silicon Standard provide the
designer with the best combination of fast switching,
ruggedized device design, ultra low on-resistance and
cost-effectiveness.
G
D S
TO-252(H)
G
D
S
TO-251(J)
Absolute Maximum Ratings
Symbol
V
DS
V
GS
I
D
@T
C
=25℃
I
D
@T
C
=125℃
I
DM
P
D
@T
C
=25℃
T
STG
T
J
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, V
GS
@ 4.5V
Continuous Drain Current, V
GS
@ 4.5V
Pulsed Drain Current
1
Total Power Dissipation
Linear Derating Factor
Storage Temperature Range
Operating Junction Temperature Range
Rating
20
±
12
45
20
140
48
0.38
-55 to 150
-55 to 150
Units
V
V
A
A
A
W
W/℃
℃
℃
Thermal Data
Symbol
Rthj-c
Rthj-a
Parameter
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Max.
Max.
Value
2.6
110
Unit
℃/W
℃/W
Rev.2.01 6/26/2003
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1 of 6
SSM9918H,J
Electrical Characteristics @ T
j
=25
o
C (unless otherwise specified)
Symbol
BV
DSS
ΔBV
DSS
/ΔT
j
Parameter
Drain-Source Breakdown Voltage
Test Conditions
V
GS
=0V, I
D
=250uA
Min.
20
-
-
-
0.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ.
-
0.1
-
-
-
26
-
-
-
19
1.5
10.5
7.5
83
18
23
500
310
125
Max. Units
-
-
14
28
1.2
-
1
25
±100
-
-
-
-
-
-
-
-
-
-
V
V/℃
mΩ
mΩ
V
S
uA
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
Breakdown Voltage Temperature Coefficient
Reference to 25℃, I
D
=1mA
R
DS(ON)
Static Drain-Source On-Resistance
V
GS
=4.5V, I
D
=18A
V
GS
=2.5V, I
D
=9A
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current (T
j
=25
o
C)
Drain-Source Leakage Current (T
j
=125
o
C)
V
DS
=V
GS
, I
D
=250uA
V
DS
=10V, I
D
=18A
V
DS
=20V, V
GS
=0V
V
DS
=20V ,V
GS
=0V
V
GS
=
±
12V
I
D
=18A
V
DS
=20V
V
GS
=5V
V
DS
=10V
I
D
=18A
R
G
=3.3Ω,V
GS
=5V
R
D
=0.56Ω
V
GS
=0V
V
DS
=20V
f=1.0MHz
Gate-Source Leakage
Total Gate Charge
2
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
2
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Source-Drain Diode
Symbol
I
S
I
SM
V
SD
Parameter
Continuous Source Current ( Body Diode )
Test Conditions
V
D
=V
G
=0V , V
S
=1.3V
T
j
=25℃, I
S
=45A, V
GS
=0V
Min.
-
-
-
Typ.
-
-
-
Max. Units
45
140
1.3
A
A
V
Pulsed Source Current ( Body Diode )
1
Forward On Voltage
2
Notes:
1.Pulse width limited by safe operating area.
2.Pulse width <300us , duty cycle <2%.
Rev.2.01 6/26/2003
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2 of 6
SSM9918H,J
120
80
T
C
=25
o
C
V
G
=4.5V
T
C
=150
o
C
V
G
=4.5V
V
G
=4.0V
V
G
=4.0V
I
D
, Drain Current (A)
80
60
V
G
=3.5V
V
G
=3.5V
I
D
, Drain Current (A)
V
G
=3.0V
40
V
G
=3.0V
40
V
G
=2.5V
20
V
G
=2.5V
0
0
1
2
3
4
0
0
1
2
3
4
V
DS
, Drain-to-Source Voltage (V)
V
DS
, Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
26
1.8
I
D
= 18 A
24
I
D
=18A
1.6
T
C
=25
o
C
V
G
=4.5V
22
20
Normalized R
DS(ON)
1
2
3
4
5
6
1.4
R
DSON
(m
Ω
)
18
1.2
16
1.0
14
0.8
12
10
0.6
-50
0
50
100
150
V
GS
(V)
T
j
, Junction Temperature ( C)
o
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
Rev.2.01 6/26/2003
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3 of 6
SSM9918H,J
50
60
50
40
I
D
, Drain Current (A)
40
30
P
D
(W)
20
10
0
25
50
75
100
125
150
30
20
10
0
0
50
100
150
T
c
, Case Temperature ( C)
o
T
c
, Case Temperature ( C)
o
Fig 5. Maximum Drain Current v.s.
Fig 6. Typical Power Dissipation
Case Temperature
1000
1
DUTY=0.5
Normalized Thermal Response (R
thjc
)
0.2
100
10us
I
D
(A)
0.1
0.1
0.05
100us
10
0.02
P
DM
SINGLE PULSE
0.01
t
T
1ms
T
c
=25
o
C
Single Pulse
1
1
10
100
10ms
100ms
Duty factor = t/T
Peak T
j
= P
DM
x R
thjc
+ T
C
0.01
0.00001
0.0001
0.001
0.01
0.1
1
V
DS
(V)
t , Pulse Width (s)
Fig 7. Maximum Safe Operating Area
Fig 8. Effective Transient Thermal Impedance
Rev.2.01 6/26/2003
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4 of 6
SSM9918H,J
12
10000
f=1.0MHz
I
D
=18A
10
V
DS
=10V
V
DS
=15V
V
GS
, Gate to Source Voltage (V)
8
V
DS
=20V
C (pF)
1000
Ciss
6
Coss
4
100
Crss
2
0
0
5
10
15
20
25
30
35
10
1
5
9
13
17
21
25
29
V
DS
(V)
Q
G
, Total Gate Charge (nC)
Fig 9. Gate Charge Characteristics
Fig 10. Typical Capacitance Characteristics
100
1.6
1.4
10
1.2
T
j
=150 C
V
GS(th)
(V)
1.2
1.6
o
T
j
=25
o
C
I
F
(A)
1
1
0.8
0.6
0.1
0.4
0.01
0
0.4
0.8
0.2
-50
0
50
100
150
V
SD
(V)
Junction Temperature ( C )
o
Fig 11. Forward Characteristic of
Reverse Diode
Fig 12. Gate Threshold Voltage v.s.
Junction Temperature
Rev.2.01 6/26/2003
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5 of 6
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