|
MV2109RLRP |
MMBV2108L |
MMBV2103L |
Description |
HF-UHF BAND, 33pF, 30V, SILICON, ABRUPT VARIABLE CAPACITANCE DIODE, TO-92, PLASTIC, CASE 182-06, TO-226AC, 2 PIN |
27pF, 30V, SILICON, VARIABLE CAPACITANCE DIODE, TO-236AB, LEAD FREE, PLASTIC, CASE 318-08, TO-236, 3 PIN |
10pF, 30V, SILICON, VARIABLE CAPACITANCE DIODE, TO-236AB, PLASTIC, CASE 318-08, 3 PIN |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
Maker |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
Parts packaging code |
TO-92 |
SOT-23 |
SOT-23 |
package instruction |
PLASTIC, CASE 182-06, TO-226AC, 2 PIN |
LEAD FREE, PLASTIC, CASE 318-08, TO-236, 3 PIN |
PLASTIC, CASE 318-08, 3 PIN |
Contacts |
3 |
3 |
3 |
Manufacturer packaging code |
CASE 182-06 |
CASE 318-08 |
CASE 318-08 |
Reach Compliance Code |
not_compliant |
unknown |
not_compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
Other features |
HIGH RELIABILITY |
HIGH Q, HIGH RELIABILITY |
HIGH RELIABILITY |
Minimum breakdown voltage |
30 V |
30 V |
30 V |
Configuration |
SINGLE |
SINGLE |
SINGLE |
Diode Capacitance Tolerance |
10% |
10% |
10% |
Minimum diode capacitance ratio |
2.5 |
2.5 |
2.5 |
Nominal diode capacitance |
33 pF |
27 pF |
10 pF |
Diode component materials |
SILICON |
SILICON |
SILICON |
Diode type |
VARIABLE CAPACITANCE DIODE |
VARIABLE CAPACITANCE DIODE |
VARIABLE CAPACITANCE DIODE |
JEDEC-95 code |
TO-92 |
TO-236AB |
TO-236AB |
JESD-30 code |
O-PBCY-T2 |
R-PDSO-G3 |
R-PDSO-G3 |
JESD-609 code |
e0 |
e0 |
e0 |
Number of components |
1 |
1 |
1 |
Number of terminals |
2 |
3 |
3 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Package shape |
ROUND |
RECTANGULAR |
RECTANGULAR |
Package form |
CYLINDRICAL |
SMALL OUTLINE |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
240 |
240 |
240 |
Maximum power dissipation |
0.28 W |
0.225 W |
0.225 W |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
minimum quality factor |
200 |
300 |
400 |
Maximum repetitive peak reverse voltage |
30 V |
30 V |
30 V |
surface mount |
NO |
YES |
YES |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
GULL WING |
GULL WING |
Terminal location |
BOTTOM |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
30 |