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M36WT864BF10ZA6

Description
SPECIALTY MEMORY CIRCUIT, PBGA96, 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96
Categorystorage    storage   
File Size449KB,92 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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M36WT864BF10ZA6 Overview

SPECIALTY MEMORY CIRCUIT, PBGA96, 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96

M36WT864BF10ZA6 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeBGA
package instruction8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96
Contacts96
Reach Compliance Codenot_compliant
Maximum access time100 ns
Other featuresSRAM IS ORGANIZED AS 512K X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 codeR-PBGA-B96
JESD-609 codee0
length14 mm
memory density67108864 bit
Memory IC TypeMEMORY CIRCUIT
memory width16
Mixed memory typesFLASH+SRAM
Number of functions1
Number of terminals96
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA96,8X14,32
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
power supply1.8/2,3 V
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum standby current0.00002 A
Maximum slew rate0.035 mA
Maximum supply voltage (Vsup)2.2 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width8 mm
M36WT864TF
M36WT864BF
64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory
and 8 Mbit (512K x16) SRAM, Multiple Memory Product
PRODUCT PREVIEW
FEATURES SUMMARY
s
SUPPLY VOLTAGE
– V
DDF
= 1.65V to 2.2V
– V
DDS
= V
DDQF
= 2.7V to 3.3V
– V
PPF
= 12V for Fast Program (optional)
s
s
s
SRAM
s
8 Mbit (512K x 16 bit)
s
s
s
s
s
EQUAL CYCLE and ACCESS TIMES: 70ns
LOW STANDBY CURRENT
LOW V
DDS
DATA RETENTION: 1.5V
TRI-STATE COMMON I/O
AUTOMATIC POWER DOWN
ACCESS TIME: 70, 85, 100ns
LOW POWER CONSUMPTION
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Top Device Code, M36WT864TF: 8810h
– Bottom Device Code, M36WT864BF: 8811h
Figure 1. Packages
FLASH MEMORY
s
PROGRAMMING TIME
– 8µs by Word typical for Fast Factory Program
– Double/Quadruple Word Program option
– Enhanced Factory Program options
s
FBGA
MEMORY BLOCKS
– Multiple Bank Memory Array: 4 Mbit Banks
– Parameter Blocks (Top or Bottom location)
Stacked LFBGA96 (ZA)
8 x 14mm
s
DUAL OPERATIONS
– Program Erase in one Bank while Read in
others
– No delay between Read and Write operations
s
BLOCK LOCKING
– All blocks locked at Power up
– Any combination of blocks can be locked
– WP for Block Lock-Down
s
SECURITY
– 128 bit user programmable OTP cells
– 64 bit unique device number
– One parameter block permanently lockable
s
s
COMMON FLASH INTERFACE (CFI)
100,000 PROGRAM/ERASE CYCLES per
BLOCK
July 2002
This is preliminary information on a new product now in development. Details are subject to change without notice.
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Description SPECIALTY MEMORY CIRCUIT, PBGA96, 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 SPECIALTY MEMORY CIRCUIT, PBGA96, 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 SPECIALTY MEMORY CIRCUIT, PBGA96, 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 SPECIALTY MEMORY CIRCUIT, PBGA96, 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 SPECIALTY MEMORY CIRCUIT, PBGA96, 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 SPECIALTY MEMORY CIRCUIT, PBGA96, 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 SPECIALTY MEMORY CIRCUIT, PBGA96, 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 SPECIALTY MEMORY CIRCUIT, PBGA96, 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code BGA BGA BGA BGA BGA BGA BGA BGA
package instruction 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96 8 X 14 MM, 0.80 MM PITCH, STACK, LFBGA-96
Contacts 96 96 96 96 96 96 96 96
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
Maximum access time 100 ns 85 ns 70 ns 85 ns 85 ns 70 ns 70 ns 100 ns
Other features SRAM IS ORGANIZED AS 512K X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SRAM ORGANISATION IS 512K X 16 SRAM ORGANISATION IS 512K X 16 SRAM ORGANISATION IS 512K X 16 SRAM ORGANISATION IS 512K X 16 SRAM ORGANISATION IS 512K X 16 SRAM ORGANISATION IS 512K X 16 SRAM IS ORGANIZED AS 512K X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 code R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
memory density 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
memory width 16 16 16 16 16 16 16 16
Mixed memory types FLASH+SRAM FLASH+SRAM FLASH+SRAM FLASH+SRAM FLASH+SRAM FLASH+SRAM FLASH+SRAM FLASH+SRAM
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 96 96 96 96 96 96 96 96
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000 4000000 4000000 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA LFBGA LFBGA LFBGA LFBGA LFBGA LFBGA
Encapsulate equivalent code BGA96,8X14,32 BGA96,8X14,32 BGA96,8X14,32 BGA96,8X14,32 BGA96,8X14,32 BGA96,8X14,32 BGA96,8X14,32 BGA96,8X14,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
power supply 1.8/2,3 V 1.8/2,3 V 1.8/2,3 V 1.8/2,3 V 1.8/2,3 V 1.8/2,3 V 1.8/2,3 V 1.8/2,3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm
Maximum standby current 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A
Maximum slew rate 0.035 mA 0.035 mA 0.035 mA 0.035 mA 0.035 mA 0.035 mA 0.035 mA 0.035 mA
Maximum supply voltage (Vsup) 2.2 V 2.2 V 2.2 V 2.2 V 2.2 V 2.2 V 2.2 V 2.2 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
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