HY23V08200D-100 datasheet, PDF

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HY23V08200D-100: DescriptionMASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42; Categorystorage storage; File Size82KB，6 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY23V08200D-100 Overview

MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42

HY23V08200D-100 Parametric

Parameter Name	Attribute value
Maker	SK Hynix
Parts packaging code	DIP
package instruction	DIP,
Contacts	42
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	100 ns
Spare memory width	8
JESD-30 code	R-PDIP-T42
length	52.451 mm
memory density	8388608 bit
Memory IC Type	MASK ROM
memory width	16
Number of functions	1
Number of terminals	42
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX16
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.826 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

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HY23V08200

Description

512K X 16/1M X 8 BIT

CMOS MASK ROM

The HY23V08200 high performance read only memory is organized either as 1,048,576 x 8 bit (byte mode) or

as 524,288 x 16 bit(word mode) followed by BHE mode select. The low power feature allows the battery

operation.

The large size of 8M bit memory density is ideal for character generator, data or program

memory in micro-processor application. The HY23V08200 is packaged 42pin DIP or 44 pin SOP.

Key features

• Switchable Organization

Byte Mode : 1,048,576 X 8 bit

Word Mode : 524,288 X 16 bit

• Single 3.3V power supply operation

• Access Time : 100/120ns (Max)

• Standby Current : 50 (Max)

• Operating Current : 35 (Max)

• TTL compatible inputs and outputs

• 3-State outputs for wired-OR expansion

• Word or Byte switchable by BHE pin

• Programmable CE or OE pin

• Fully static operation

• Package

HY23V08200D

: 42pin Plastic DIP(600 mil)

HY23V08200S

: 44pin Plastic SOP(500mil)

Pin Description

A0~A18

Q0~Q14

Q15/A-1

BHE

CEB*

OEB*

VCC

VSS

Function

Address inputs

Data Outputs

Output Q15(Word Mode)/

LSB Address(Byte Mode)

Byte High Enable input

(Word/Byte selection)

Chip Enable input

Output Enable input

Power supply

Ground

No Connection

Pin Configuration

A18

A17

CEB

VSS

OEB

Q10

Q11

A10

A11

A12

A13

A14

A15

A16

BHE

VSS

Q15/A-1

Q14

Q13

Q12

VCC

A18

A17

CEB

VSS

OEB

Q10

Q11

* User selectable polarity

44SOP

A10

A11

A12

A13

A14

A15

A16

BHE

VSS

Q15/A-1

Q14

Q13

Q12

VCC

42DIP

HY23V08200D

HY23V08200S

Rev0 Page 1 of 6

HY23V08200D-100 Related Products

	HY23V08200D-100	HY23V08200S-100	HY23V08200D-70	HY23V08200D-120	HY23V08200S-70	HY23V08200S-120
Description	MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44	MASK ROM, 512KX16, 70ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 512KX16, 70ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44	MASK ROM, 512KX16, 120ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	DIP	SOIC	DIP	DIP	SOIC	SOIC
package instruction	DIP,	SOP,	DIP,	DIP,	SOP,	SOP,
Contacts	42	44	42	42	44	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	100 ns	100 ns	70 ns	120 ns	70 ns	120 ns
Spare memory width	8	8	8	8	8	8
JESD-30 code	R-PDIP-T42	R-PDSO-G44	R-PDIP-T42	R-PDIP-T42	R-PDSO-G44	R-PDSO-G44
length	52.451 mm	28.5 mm	52.451 mm	52.451 mm	28.5 mm	28.5 mm
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	42	44	42	42	44	44
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	512KX16	512KX16	512KX16	512KX16	512KX16	512KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	DIP	DIP	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.826 mm	3.2 mm	4.826 mm	4.826 mm	3.2 mm	3.2 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	YES	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	12.6 mm	15.24 mm	15.24 mm	12.6 mm	12.6 mm

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